公开(公告)号：DE69013945T2

公开(公告)日：1995-05-24

申请号：DE69013945

申请日：1990-02-01

Applicant: IBM

Inventor： DAY RICHARD ALLEN ,  GELORME JEFFREY DONALD ,  RUSSELL DAVID JOHN ,  WITT STEVEN JO

IPC: C08G59/00 ,  C08G59/20 ,  C08G59/30 ,  C08G59/62 ,  C08G59/68 ,  C08L63/00 ,  G03F7/038

公开(公告)号：AT56828T

公开(公告)日：1990-10-15

申请号：AT86114201

申请日：1986-10-14

Applicant: IBM

Inventor： GELORME JEFFREY DONALD ,  COX ROBERT JAMES ,  GUTIERREZ SERGIO ADOLFO RUIZ

IPC: G03F7/004 ,  C08G59/00 ,  C08G59/68 ,  G03F7/027 ,  G03F7/038 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/28

公开(公告)号：BR8604549A

公开(公告)日：1987-05-26

申请号：BR8604549

申请日：1986-09-23

Applicant: IBM

Inventor： GELORME JEFFREY DONALD ,  COX ROBERT JAMES ,  GUTIERREZ SERGIO ADOLFO RUIZ

IPC: G03F7/004 ,  C08G59/00 ,  C08G59/68 ,  G03F7/027 ,  G03F7/038 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/28 ,  B05D5/06 ,  C08L63/00 ,  H05K3/46

公开(公告)号：ES2141530T3

公开(公告)日：2000-03-16

申请号：ES96930255

申请日：1996-09-12

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  GELORME JEFFREY DONALD ,  KOSBAR LAURA LOUISE

IPC: B32B27/00 ,  B32B27/16 ,  B32B27/18 ,  C08G59/40 ,  C08H3/00 ,  C08H6/00 ,  C08H7/00 ,  C08J5/04 ,  C08K3/00 ,  C08K5/1515 ,  C08K5/16 ,  C08L5/00 ,  C08L63/00 ,  C08L91/00 ,  C08L93/00 ,  C08L97/00 ,  C08L99/00 ,  H05K1/03 ,  C08H5/02

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fibreglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

公开(公告)号：DE69400718T2

公开(公告)日：1997-04-03

申请号：DE69400718

申请日：1994-02-07

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  GELORME JEFFREY DONALD ,  NEWMAN THOMAS HAROLD ,  PATEL NIRANJAN MOHANLAL

IPC: C08G61/12 ,  C08G61/10 ,  C08G75/02 ,  C08G75/04 ,  C08J3/28 ,  C08L33/00 ,  C08L33/02 ,  C08L41/00 ,  C08L79/00 ,  C08L101/00 ,  C08L101/02 ,  C08L101/12 ,  G03F7/038 ,  G03F7/09 ,  H01B1/12 ,  G03F7/11

公开(公告)号：AU620936B2

公开(公告)日：1992-02-27

申请号：AU4466889

申请日：1989-11-14

Applicant: IBM

Inventor： ANGELO RAYMOND WILLIAM ,  GELORME JEFFREY DONALD ,  KUCZYNSKI JOSEPH PAUL ,  LAWRENCE WILLIMA HOWELL ,  PAPPAS SOCRATES PETER ,  SIMPSON LOGAN LLOYD

IPC: C07C381/12 ,  C08G59/00 ,  C08G59/18 ,  C08G59/68 ,  G03F7/029 ,  G03C1/71

Abstract: Sulfonium salts of the formula: wherein Ar is a fused aromatic radical; R1 is a divalent organic bridge; each R2 and R3 individually is an alkyl, aryl, alkaryl, aralkyl or substituted aryl, provided that not more than one of R2 and R3 is alkyl; and A is a non-nucleophilic anion; use thereof and preparation thereof.

公开(公告)号：BR8905837A

公开(公告)日：1990-06-12

申请号：BR8905837

申请日：1989-11-20

Applicant: IBM

Inventor： ANGELO RAYMOND WILLIAM ,  GELORME JEFFREY DONALD ,  KUCZYNSKI JOSEPH PAUL ,  LAWRENCE WILLIAM HOWELL ,  PAPPAS SOCRATES PETER ,  SIMPSN LOGAN LLOYD

IPC: C07C381/12 ,  C08G59/00 ,  C08G59/18 ,  C08G59/68 ,  G03F7/029 ,  C07C309/04 ,  C07C309/08 ,  C07C309/23 ,  C08L63/00

Abstract: Sulfonium salts of the formula: wherein Ar is a fused aromatic radical; R1 is a divalent organic bridge; each R2 and R3 individually is an alkyl, aryl, alkaryl, aralkyl or substituted aryl, provided that not more than one of R2 and R3 is alkyl; and A is a non-nucleophilic anion; use thereof and preparation thereof.

公开(公告)号：DE69517788T2

公开(公告)日：2000-12-14

申请号：DE69517788

申请日：1995-12-22

Applicant: IBM

Inventor： ANGELOPOULOS MARIE ,  GELORME JEFFREY DONALD ,  KUCZYNSKI JOE

IPC: C09J9/02 ,  H01B1/12 ,  C09J201/00

Abstract: An electrically conductive pressure sensitive adhesive containing electrically conductive polymers used as an alternative to metallic solder in interconnect electronic applications.

公开(公告)号：HU9900564A2

公开(公告)日：1999-06-28

申请号：HU9900564

申请日：1996-09-12

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  GELORME JEFFREY DONALD ,  KOSBAR LAURA LOUISE

IPC: B32B27/16 ,  B32B27/18 ,  B32B27/00 ,  C08G59/40 ,  C08H3/00 ,  C08H6/00 ,  C08H7/00 ,  C08J5/04 ,  C08K3/00 ,  C08K5/1515 ,  C08K5/16 ,  C08L5/00 ,  C08L63/00 ,  C08L91/00 ,  C08L93/00 ,  C08L97/00 ,  C08L99/00 ,  H05K1/03 ,  C08H5/02

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fibreglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

公开(公告)号：DE69224503D1

公开(公告)日：1998-04-02

申请号：DE69224503

申请日：1992-10-14

Applicant: IBM

Inventor： GELORME JEFFREY DONALD ,  GOLDBERG MARTIN JOSEPH ,  LABIANCA NANCY CAROLYN ,  SHAW JANE MAR WEST

IPC: C08G73/10 ,  C08L79/08 ,  G03F7/004 ,  G03F7/027 ,  G03F7/037 ,  G03F7/038 ,  C08G73/14

Abstract: Photosensitive compositions containing a polyimide precursor and a complex cation of a polymerizable carboxylic acid functional compound with a tertiary amino functional group; and use thereof to provide a pattern.