公开(公告)号：JPH07115105A

公开(公告)日：1995-05-02

申请号：JP24287993

申请日：1993-09-29

Applicant: IBM

Inventor： KURIHARA MIKIO ,  NISHI SATORU ,  ONODERA TAKAHIRO ,  KUSHIMA KAZUNARI

IPC: G02F1/1345 ,  G02F1/13 ,  H01L21/60 ,  H05K1/14 ,  H05K3/36

Abstract: PURPOSE: To prevent the flowing of melted solder to neighboring input electrodes, to perform the processing for avoiding the concentration of stress in the shearing direction applied on the input electrodes, and to prevent the short circuits and the wire breaking between the electrodes. CONSTITUTION: The long side of a slit hole 26 in correspondence with each input electrode 28 has the irregular shape. The input electrode 28 is overlapped on a substrate electrode 30. A solder 32 is melted by heating, and both electrodes 28 and 30 are fixed. The melted solder 32 flows between a base 22 and a substrate 18A by capillary phenomenon. The flow of the solder to the neighboring input electrode 28 is blocked by forming a protruding part 26A on the long side of the slit hole 26 so as to form the irregularity and setting the base 22 connecting the neighboring input electrodes 28 in the nonlinear state. Furthermore, when a liquid cell and the substrates 18A and 18B are relatively moved, the respective independent deformations can be formed at the bonding part of the protruding part 26A and the individual input electrode 28. The concentration of the stress in the shearing direction is avoided, and the strength is increased.