公开(公告)号：JPH07129127A

公开(公告)日：1995-05-19

申请号：JP27642493

申请日：1993-11-05

Applicant: IBM

Inventor： KIMURA YASUHIRO ,  NISHI SATORU ,  ONODERA TAKAHIRO

IPC: G02F1/133 ,  G09G3/20 ,  G09G3/36

Abstract: PURPOSE: To prevent the generation of flicker, etc., when the contrast of an image to be displayed is changed. CONSTITUTION: The amplitude of a data voltage, of which the polarity is inverted at timing synchronized with the display cycle of the image, is changed corresponding to gradation and instructed contrast and the position of 0V (center) corresponding to the amplitude of the data voltage is offset by much offset quantity according to the increase of contrast. Thus, even when the instructed contrast is comparatively high and the amplitude of the data voltage is comparatively small as shown in (A) or even when the instructed contrast is comparatively low and the amplitude of the data voltage is comparatively large as shown in (B), a change ΔV of an inter-electrode voltage caused by the influence of parasitic capacitance of a TFT in the case of turning off the TFT is corrected and after the TFT is turned off, the inter-electrode voltage is made equal in spite of the polarity of data voltage to be impressed to liquid crystal.

公开(公告)号：JPH07115105A

公开(公告)日：1995-05-02

申请号：JP24287993

申请日：1993-09-29

Applicant: IBM

Inventor： KURIHARA MIKIO ,  NISHI SATORU ,  ONODERA TAKAHIRO ,  KUSHIMA KAZUNARI

IPC: G02F1/1345 ,  G02F1/13 ,  H01L21/60 ,  H05K1/14 ,  H05K3/36

Abstract: PURPOSE: To prevent the flowing of melted solder to neighboring input electrodes, to perform the processing for avoiding the concentration of stress in the shearing direction applied on the input electrodes, and to prevent the short circuits and the wire breaking between the electrodes. CONSTITUTION: The long side of a slit hole 26 in correspondence with each input electrode 28 has the irregular shape. The input electrode 28 is overlapped on a substrate electrode 30. A solder 32 is melted by heating, and both electrodes 28 and 30 are fixed. The melted solder 32 flows between a base 22 and a substrate 18A by capillary phenomenon. The flow of the solder to the neighboring input electrode 28 is blocked by forming a protruding part 26A on the long side of the slit hole 26 so as to form the irregularity and setting the base 22 connecting the neighboring input electrodes 28 in the nonlinear state. Furthermore, when a liquid cell and the substrates 18A and 18B are relatively moved, the respective independent deformations can be formed at the bonding part of the protruding part 26A and the individual input electrode 28. The concentration of the stress in the shearing direction is avoided, and the strength is increased.