公开(公告)号：JP2000236051A

公开(公告)日：2000-08-29

申请号：JP2000028596

申请日：2000-02-07

Applicant: IBM

Inventor： L WIN HERON ,  SUSHUMUNA IRUVANTEI ,  KNICKERBOCKER JOHN U ,  REEDO SHERIF

IPC: H01L23/36 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To improve cooling of an electronic circuit chip by providing a part whose one side is a practically flat plate and the other side extends outward as it is near at least a single central part. SOLUTION: A heat dissipation device 10 comprises a protrusion 15 which extends outward forming a solder layer 20 of a variable thickness. The solder layer 20 becomes thin as it is really near a central part of a boss 15. The solder layer 20 becomes thick in its outward extension direction from a central part of the boss 15. A metallization layer 21 is provided for providing proper adhesion between a chip 30 and the solder layer 20. The chip 30 is fixed to a substrate 40 by what is called flip-chip constitution. The substrate 40 comprises mutual connection which provides electrical circuit coupling between each part of the chip 30 and a pin 45. The chip 30 is fixed in mutual connection on a substrate 40 by solder hole technique, etc.