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公开(公告)号:JPS6226825A
公开(公告)日:1987-02-04
申请号:JP14040286
申请日:1986-06-18
Applicant: IBM
IPC: B05D5/00 , B05D7/26 , H01L21/312
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公开(公告)号:DE3686103T2
公开(公告)日:1993-03-04
申请号:DE3686103
申请日:1986-05-23
Applicant: IBM
IPC: B05D5/00 , B05D7/26 , H01L21/312
Abstract: A substrate is planarized by applying a liquid coating to it comprising a polyamide alkyl ester formed from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220 DEG C, and curing the coating.
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公开(公告)号:DE3686103D1
公开(公告)日:1992-08-27
申请号:DE3686103
申请日:1986-05-23
Applicant: IBM
IPC: B05D5/00 , B05D7/26 , H01L21/312
Abstract: A substrate is planarized by applying a liquid coating to it comprising a polyamide alkyl ester formed from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220 DEG C, and curing the coating.
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