公开(公告)号：CA2750412A1

公开(公告)日：2010-09-23

申请号：CA2750412

申请日：2010-02-25

Applicant: IBM

Inventor： DING HANYI ,  LAM KWAN H

IPC: H01P5/18 ,  H03D3/00 ,  H03F3/60

Abstract: A Lange coupler having a first plurality of lines (210, 220) on a first level and a second plurality of lines (230, 240) on a second level. At least one line on the first level is cross-coupled to a respective line on the second level via electromagnetic waves (250, 260, 270, 280) traveling through the first and second plurality of lines. The first and second plurality of lines may be made of metal, and the first level may be higher than the second level. A substrate (200) may be provided into which the first and second plurality of lines are etched so as to define an on-chip Lange coupler.