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公开(公告)号：CA1222218A
公开(公告)日：1987-05-26
申请号：CA506439
申请日：1986-04-11
Applicant: IBM
Inventor： BIANCHI JACQUELINE K , GDULA ROBERT A , LANGE DENNIS J
IPC: C04B41/53 , C04B41/91 , H01L21/311
Abstract: REACTIVE ION ETCHING PROCESS In a process for etching by reactive ion etching, a ceramic partially masked by an organic photoresist, an etch gas containing SF6, a noble gas and a small percentage of a carbon-containing gas is used.
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