公开(公告)号：DE1282703B

公开(公告)日：1968-11-14

申请号：DEJ0030724

申请日：1966-03-30

Applicant: IBM

Inventor： LARSON HAROLD ALBERT ,  SCHULZ FREDERICK ARTHUR ,  THOMPSON LOENARD HOWARD ,  WELLS JACK FREDERICK

IPC: B65H23/18 ,  G11B15/28 ,  G11B15/43 ,  G11B15/56 ,  G11B15/60

Abstract: 1,093,500. Recording and playback. INTERNATIONAL BUSINESS MACHINES CORPORATION. April 4, 1966 [May 3, 1965], No. 14758/66. Heading G5R. Web transport mechanism for use in a magnetic tape recorder incorporates pairs of pivoted arms e.g. 23, 40 each interconnected by springs e.g. 62. The arms control the positions of idler and pinch rollers and capstans in the tape path. In a first position shown in Fig. 1 the interconnected arms are held in a locked stable position by the spring, to define a tape path clear of drive capstans and play record heads so as to enable the tape to be easily threaded. When the tape has been threaded, a light push on the arms 23, 16 sets the arms in a second stable position where they are forced apart by the spring. The arrangement of the arm 40 is such that the drive capstan 49 engages the tape and the tape engages the heads 63 (Fig. 2, not shown) in this second position. Although in the embodiment shown the system is symmetrical at the two sides of the heads, simplified arrangements may be adopted at the non-driven side (Figs. 5 and 6, not shown).

公开(公告)号：GB1267320A

公开(公告)日：1972-03-15

申请号：GB5576270

申请日：1970-11-24

Applicant: IBM

Inventor： ANZELONE THOMAS ANTHONY JR ,  LARSON HAROLD ALBERT ,  STRICKER ALFRED ALOIS

IPC: C09J5/00 ,  H01L21/302 ,  H01L21/58

Abstract: 1,267,320. Seaming. INTERNATIONAL BUSINESS MACHINES CORP. 24 Nov., 1970 [30 Dec., 1969], No. 55762/70. Heading B5K. [Also in Divisions B3 and H1] A semi-conductor wafer 25 is bonded to a surface 17 of a support 10, which surface is flat when cool but convex as shown when hot, by heating the support 10 to the bonding temperature, spreading a bonding agent over the surface 17, placing the wafer 25 into contact with the highest point of the surface 17, e.g. using a rubber-coated vacuum tool, and maintaining the wafer 25 in contact with the surface 17 while the support 10 cools down and resumes its flat shape. The bonding agent is thus forced outwards from the highest point of the surface 17 as the latter cools, and voids in the bonding layer are avoided. After mounting in this way the wafer 25 may be cut into chips for device manufacture. The support 10 is preferably made of a phenolic resin, the bonding agent being glycol phthalate and being preheated and applied in a metered amount to the surface 17. A concave cooled forming tool is used to shape the bonding agent over the surface 17 prior to positioning of the wafer 25.