公开(公告)号：DE2241905A1

公开(公告)日：1973-03-08

申请号：DE2241905

申请日：1972-08-25

Applicant: IBM

Inventor： LAW JOHN MICHAEL ,  STRICKER ALFRED ALOIS ,  KAENEL WALTER VON

IPC: H01L21/50 ,  H01L23/50 ,  H01R43/20 ,  H05K13/02 ,  H05K13/04

Abstract: The invention is a method of automatically bonding elongated articles such as headed pins to metallized contact pads on a ceramic substrate. The elongate articles are automatically inserted into the carrier by (1) placing the carrier in a carrier support, (2) releasing elongate articles onto the carrier, (3) vibrating the support to vibrate the carrier and agitate the elongated articles, (4) applying a pressure differential between the tops and the bottoms of the holes to create air flow into the tops of the holes to suck the elongate articles into the holes, and (5) periodically reducing the pressure differential to allow the vibration to dislodge any jammed articles. The frequency and amplitude of the vibration and the duty cycle and period of the pressure differential are adjusted to dislodge jammed articles during the time the pressure differential is reduced, while retaining in the holes the elongate articles which have been inserted into the holes in a proper orientation. The bonding method comprises the steps of (1) inserting the elongate articles into holes in a carrier, (2) removing any excess articles, (3) masking the carrier to prevent bonding material adhering to the carrier, applying bonding material to the ends of the elongate articles in accordance with the mask, (5) bringing the ends of the elongate articles into contact with the contact points on the substantially flat surface to which the articles are to be bonded, (6) applying pressure to each elongate article individually, (7) heating the contact points on the substrate surface and the elongate articles to form a permanent bond between them and (8) cooling the elongate atticles and contact points to allow the bonding material to set.