Disk drive carrier assembly
    1.
    发明专利

    公开(公告)号:GB2272792A

    公开(公告)日:1994-05-25

    申请号:GB9321800

    申请日:1993-10-22

    Applicant: IBM

    Abstract: To facilitate maintenance, a disk drive assembly 40 includes a disk-head assembly (HDA) 45 and an electronic card pack 47 both releasably mounted on a carrier frame 49 e.g. using quick-release shock mounts 44, 46. In use, a carrier assembly connector plug 59 mounted at the rear edge of a circuit hoard included within the electronic card pack engages a stationary connector plug 81 mounted within a host system receiving unit. The carrier frame has guide rails 42 which are received by guide grooves or tracks 87 within the receiving unit to allow the carrier assembly to be inserted in and extracted from the receiving unit. Alignment pins 77 protruding from the connector plug 81 engage and align the connector plug 59 as the carrier assembly is inserted into the receiving unit. A locking handle 53 may provide a force to maintain the carrier assembly in place during operation.

    2.
    发明专利
    未知

    公开(公告)号:DE69318605T2

    公开(公告)日:1999-02-04

    申请号:DE69318605

    申请日:1993-03-02

    Applicant: IBM

    Abstract: A multiple disk drive assembly (10) in a 5 1/4 inch disk drive form factor having two 3 1/2 inch disk drive form factor head-disk assemblies (HDA) (11, 13) internally mounted on a rigid frame (15) and accessible via a common industry-standard interface connector (55) is provided. Both the interface and power connectors (55 and 53 respectively) and the frame mounting hole patterns are industry standard to provide interchangeability with 5 1/4 inch form factor disk drives provided by manufacturers for use in computer systems. A single electronics controller board (17) is shared by both HDAs and is mounted on the bottom side of the frame below the HDAs. The controller board may implement SCSI or IPI interfaces in either differential or single-ended versions. A spring vibration damper (47) is utilized to minimize external vibration and shock effects on the HDAs and also to minimize the effects of vibration internally generated by one HDA on the adjacent HDA. The assembly is fully enclosed with metal top and bottom covers (19 and 21 respectively) to provide separate enclosures for the HDAs and the controller board cooling and to provide EMC and RFI protection.

    3.
    发明专利
    未知

    公开(公告)号:AT166486T

    公开(公告)日:1998-06-15

    申请号:AT93301584

    申请日:1993-03-02

    Applicant: IBM

    Abstract: A multiple disk drive assembly (10) in a 5 1/4 inch disk drive form factor having two 3 1/2 inch disk drive form factor head-disk assemblies (HDA) (11, 13) internally mounted on a rigid frame (15) and accessible via a common industry-standard interface connector (55) is provided. Both the interface and power connectors (55 and 53 respectively) and the frame mounting hole patterns are industry standard to provide interchangeability with 5 1/4 inch form factor disk drives provided by manufacturers for use in computer systems. A single electronics controller board (17) is shared by both HDAs and is mounted on the bottom side of the frame below the HDAs. The controller board may implement SCSI or IPI interfaces in either differential or single-ended versions. A spring vibration damper (47) is utilized to minimize external vibration and shock effects on the HDAs and also to minimize the effects of vibration internally generated by one HDA on the adjacent HDA. The assembly is fully enclosed with metal top and bottom covers (19 and 21 respectively) to provide separate enclosures for the HDAs and the controller board cooling and to provide EMC and RFI protection.

    4.
    发明专利
    未知

    公开(公告)号:DE69318605D1

    公开(公告)日:1998-06-25

    申请号:DE69318605

    申请日:1993-03-02

    Applicant: IBM

    Abstract: A multiple disk drive assembly (10) in a 5 1/4 inch disk drive form factor having two 3 1/2 inch disk drive form factor head-disk assemblies (HDA) (11, 13) internally mounted on a rigid frame (15) and accessible via a common industry-standard interface connector (55) is provided. Both the interface and power connectors (55 and 53 respectively) and the frame mounting hole patterns are industry standard to provide interchangeability with 5 1/4 inch form factor disk drives provided by manufacturers for use in computer systems. A single electronics controller board (17) is shared by both HDAs and is mounted on the bottom side of the frame below the HDAs. The controller board may implement SCSI or IPI interfaces in either differential or single-ended versions. A spring vibration damper (47) is utilized to minimize external vibration and shock effects on the HDAs and also to minimize the effects of vibration internally generated by one HDA on the adjacent HDA. The assembly is fully enclosed with metal top and bottom covers (19 and 21 respectively) to provide separate enclosures for the HDAs and the controller board cooling and to provide EMC and RFI protection.

    Disk drive system
    5.
    发明专利

    公开(公告)号:SG44367A1

    公开(公告)日:1997-12-19

    申请号:SG1995002341

    申请日:1993-03-02

    Applicant: IBM

    Abstract: A multiple disk drive assembly (10) in a 5 1/4 inch disk drive form factor having two 3 1/2 inch disk drive form factor head-disk assemblies (HDA) (11, 13) internally mounted on a rigid frame (15) and accessible via a common industry-standard interface connector (55) is provided. Both the interface and power connectors (55 and 53 respectively) and the frame mounting hole patterns are industry standard to provide interchangeability with 5 1/4 inch form factor disk drives provided by manufacturers for use in computer systems. A single electronics controller board (17) is shared by both HDAs and is mounted on the bottom side of the frame below the HDAs. The controller board may implement SCSI or IPI interfaces in either differential or single-ended versions. A spring vibration damper (47) is utilized to minimize external vibration and shock effects on the HDAs and also to minimize the effects of vibration internally generated by one HDA on the adjacent HDA. The assembly is fully enclosed with metal top and bottom covers (19 and 21 respectively) to provide separate enclosures for the HDAs and the controller board cooling and to provide EMC and RFI protection.

Patent Agency Ranking