公开(公告)号：JPH0637442A

公开(公告)日：1994-02-10

申请号：JP10633793

申请日：1993-05-07

Applicant: IBM

Inventor： LEERSSEN ARTHUR LEROY ,  MACE EVERITT WILLIAM ,  MAHMOUD ISSA SAID ,  RANDOLPH CHARLES TAYLOR ,  REECE JOHN ,  SETTLE GASTON GENE ,  TRUONG PHONG THAI ,  VASAN SRINI VARADARAJAN

IPC: B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H05K3/12 ,  H05K3/34 ,  H05K13/04

Abstract: PURPOSE: To realize soldering to a minute pitch land with no bridging generated by allowing a solder paste to be screened through a mask. CONSTITUTION: A resist 6 is processed so as to provide the same height as a copper land 4 on a substrate 2, so that a solder 30 is imprinted through a hole 22 of a mask 20 of an appropriate size, and with a platen 50 which absorbs the solder 30 and warps, a sufficient heat and pressure for re-flow of the solder 30 is applied. The hole 22 of the mask 20 is in mil units, so as to be at about a level obtained by multiplying the number of corresponding lands 4 by a pitch, and the heated platen 50 falls to contact to the solder 30 and remains there, until the solder 30 melts. Thus, the platen 50 such as not absorbing the solder 30 rises and a remaining flux and solder particles are removed. Thus, a specified amount of solder is accurately stuck to a minute pitch conducting line, for the realization of soldering to a minute pitch land.