公开(公告)号：CA2302907C

公开(公告)日：2004-10-19

申请号：CA2302907

申请日：2000-03-29

Applicant: IBM

Inventor： BOLDE LANNIE R ,  GRUBER PETER ALFRED ,  LEI CHON CHEONG

IPC: B23K3/06 ,  H01L21/48 ,  H05K3/34

Abstract: Disclosed is a solder injection mold apparatus and method for providing sold er balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit end s to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which th e substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutual ly compatible with respect to CTE when exposed to temperatures of molten solder.

公开(公告)号：CA2302907A1

公开(公告)日：2001-09-29

申请号：CA2302907

申请日：2000-03-29

Applicant: IBM

Inventor： LEI CHON CHEONG ,  BOLDE LANNIE R ,  GRUBER PETER ALFRED

IPC: B23K3/06 ,  H01L21/48 ,  H05K3/34

Abstract: Disclosed is a solder injection mold apparatus and method for providing sold er balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit end s to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which th e substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutual ly compatible with respect to CTE when exposed to temperatures of molten solder.