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    Method and system of injection molding of conductive material (rotating filling technique for injection molding of solder)
    1.
    发明专利
    Method and system of injection molding of conductive material (rotating filling technique for injection molding of solder) 有权
    导电材料注射成型方法及系统（铸造注射成型的旋转填充技术）

    公开(公告)号：JP2007294959A

    公开(公告)日：2007-11-08

    申请号：JP2007105961

    申请日：2007-04-13

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： STEVEN ALAN CORDES ,  SPEIDELL JAMES L ,  GRUBER PETER ALFRED ,  KNICKERBOCKER JOHN U

    IPC: H01L21/60 ,  B23K3/06

    CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2201/40 ,  H01L2224/11

    Abstract: PROBLEM TO BE SOLVED: To provide a system and a method for injection molding of conductive bonding material to a plurality of cavities of a non-rectangular mold. SOLUTION: This method includes aligning a filling head with the non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The filling head is arranged so as to substantially contact the non-rectangular mold. Rotational motion is given to at least any one of the non-rectangular mode and the filling head in a state where the filling head substantially contacts the non-rectangular mold. The conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided to at least any one of the plurality of cavities simultaneously with the approximation of at least the one cavity to the filling head. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种用于将导电接合材料注射成型到非矩形模具的多个空腔的系统和方法。

    解决方案：该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被布置成基本接触非矩形模具。 在填充头基本上接触非矩形模具的状态下，对非矩形模式和填充头中的至少任何一个进行旋转运动。 导电接合材料被迫从非矩形模具中排出填料头。 导电接合材料被提供到多个空腔中的至少任一个同时与至少一个空腔近似到填充头。 版权所有（C）2008，JPO＆INPIT

    Filling technology of conductive bonding material
    2.
    发明专利
    Filling technology of conductive bonding material 有权
    导电粘合材料填充技术

    公开(公告)号：JP2007294954A

    公开(公告)日：2007-11-08

    申请号：JP2007104611

    申请日：2007-04-12

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： STEVEN ALAN CORDES ,  SPEIDELL JAMES L ,  GRUBER PETER ALFRED ,  KNICKERBOCKER JOHN U

    IPC: H05K3/34 ,  H05K3/10

    CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2201/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

    Abstract: PROBLEM TO BE SOLVED: To provide a system and a method for feeding conductive bonding material into a plurality of cavities in a circuit support substrate.
    SOLUTION: The system, the method and a device for feeding the conductive bonding material into the plurality of cavities in the circuit support substrate are disclosed. The method includes a step for setting up a filling head in a state that it contacts the circuit support substrate substantially. The circuit support substrate includes at least one cavity. While the filling head contacts the circuit support substrate substantially, straight-line motion or rotational movement is imparted to at least one of the circuit support substrate and the filling head. The conductive bonding material is extruded toward the circuit support substrate from the filling head. At the same time at least one cavity comes very close to the filling head, the conductive bonding material is fed into at least the one cavity.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种用于将导电接合材料馈送到电路支撑衬底中的多个空腔中的系统和方法。 公开了用于将导电接合材料馈送到电路支撑衬底中的多个空腔中的系统，方法和装置。 该方法包括基本上与电路支撑基板接触的状态下设置充填头的步骤。 电路支撑基板包括至少一个空腔。 当填充头基本上接触电路支撑衬底时，直线运动或旋转运动被赋予电路支撑衬底和填充头中的至少一个。 导电接合材料从填充头朝向电路支撑基板挤出。 同时，至少一个空腔非常靠近填充头，导电粘合材料被送入至少一个空腔。 版权所有（C）2008，JPO＆INPIT

    4.
    发明专利
    未知

    公开(公告)号：DE69332196T2

    公开(公告)日：2003-05-15

    申请号：DE69332196

    申请日：1993-03-22

    Applicant: IBM

    Inventor： FERENCE THOMAS GEORGE ,  GRUBER PETER ALFRED ,  HERNANDEZ BERNARDO ,  PALMER MICHAEL JOHN ,  ZINGHER ARTHUR RICHARD

    IPC: B23K3/00 ,  B23K1/20 ,  B23K3/06 ,  B29C45/00 ,  H05K3/34 ,  H01L21/48 ,  H01L21/00

    Abstract: An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir (46) for molten solder which is disposed over a cavity in an injection plate (34). The injection plate is disposed over a mold (32) having an array of cavities therein into which solder is injection molded. The mold is disposed over a workpiece (50), such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity (68) in the injection plate (34) disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate (34) is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.

    PLASTER SOLDER ARRAY USING INJECTION MOLDED SOLDER
    5.
    发明专利
    PLASTER SOLDER ARRAY USING INJECTION MOLDED SOLDER 未知

    公开(公告)号：CA2302907A1

    公开(公告)日：2001-09-29

    申请号：CA2302907

    申请日：2000-03-29

    Applicant: IBM

    Inventor： LEI CHON CHEONG ,  BOLDE LANNIE R ,  GRUBER PETER ALFRED

    IPC: B23K3/06 ,  H01L21/48 ,  H05K3/34

    Abstract: Disclosed is a solder injection mold apparatus and method for providing sold er balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit end s to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which th e substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutual ly compatible with respect to CTE when exposed to temperatures of molten solder.

    PLASTER SOLDER ARRAY USING INJECTION MOLDED SOLDER
    6.
    发明专利
    PLASTER SOLDER ARRAY USING INJECTION MOLDED SOLDER 未知

    公开(公告)号：CA2302907C

    公开(公告)日：2004-10-19

    申请号：CA2302907

    申请日：2000-03-29

    Applicant: IBM

    Inventor： BOLDE LANNIE R ,  GRUBER PETER ALFRED ,  LEI CHON CHEONG

    IPC: B23K3/06 ,  H01L21/48 ,  H05K3/34

    Abstract: Disclosed is a solder injection mold apparatus and method for providing sold er balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit end s to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which th e substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutual ly compatible with respect to CTE when exposed to temperatures of molten solder.

    7.
    发明专利
    未知

    公开(公告)号：DE69332196D1

    公开(公告)日：2002-09-19

    申请号：DE69332196

    申请日：1993-03-22

    Applicant: IBM

    Inventor： FERENCE THOMAS GEORGE ,  GRUBER PETER ALFRED ,  HERNANDEZ BERNARDO ,  PALMER MICHAEL JOHN ,  ZINGHER ARTHUR RICHARD

    IPC: B23K3/00 ,  B23K1/20 ,  B23K3/06 ,  B29C45/00 ,  H05K3/34 ,  H01L21/48 ,  H01L21/00

    Abstract: An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir (46) for molten solder which is disposed over a cavity in an injection plate (34). The injection plate is disposed over a mold (32) having an array of cavities therein into which solder is injection molded. The mold is disposed over a workpiece (50), such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity (68) in the injection plate (34) disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate (34) is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.

    8.
    发明专利
    未知

    公开(公告)号：DE69123281D1

    公开(公告)日：1997-01-09

    申请号：DE69123281

    申请日：1991-03-20

    Applicant: IBM

    Inventor： GRUBER PETER ALFRED ,  ZINGHER ARTHUR R

    IPC: F28F3/12 ,  F28F27/02 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

    Abstract: A cooling hat for transferring heat from a surface (48) plurality of heat generating components to a flowing fluid includes a coldsheet (14), a plurality of manifold layers (20) and springs (66). The coldsheet is typically a medium-thin metal sheet usually with fine fins (56) or grooves (58) to readily transfer heat to a coolant. Each manifold layer is typically molded rubber with conduits for coolant supply and return. The conduits form a branched hierarchy. The fluid flow is highly parallel and streamlined which achieves ample flow with small hydraulic differential pressure. Springs gently urge the cooling hat against the thermal joints hence against the components. The hat can bend slightly to conform to a curved surface. Typically some compliance is provided by the hat, and other compliance is provided by a thermal joint between each component and the coldsheet. The system is highly self-aligned for counteracting variations.

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