公开(公告)号：CA1143862A

公开(公告)日：1983-03-29

申请号：CA365431

申请日：1980-11-25

Applicant: IBM

Inventor： BARBOUR DONALD R ,  LEMKE GUIDO A ,  MAGDO STEVEN

IPC: H05K3/46 ,  H01L23/14 ,  H01L23/538 ,  H01L23/66 ,  H05K1/14

Abstract: High Performance Semiconductor Package Assembly An improved high performance semiconductor package assembly for interconnecting a plurality of integrated circuit devices having a multilayer substrate with internal wiring including signal wiring and external signal and power connections, a plurality of integrated circuit semiconductor devices supported on the top surface of the substrate in electrically connected operative relation, the improvement being a power supply distribution system for providing electrical supply voltages to the devices from the power connections consisting of radial waveguide structure including parallel waveguide planes with a low input impedence to reduce switching noise, the waveguide planes located between the signal fan-out wiring and internal wiring metallurgy and connected in common to all of the plurality of devices.