公开(公告)号：US3615471A

公开(公告)日：1971-10-26

申请号：US3615471D

申请日：1968-08-12

Applicant: IBM

Inventor： LENOBLE JEAN PAUL ,  ALBERT BERTRAND JACQUES ,  BOCHARD FRANCOIS G ,  COQUARD JACQUES A ,  NORTURE ROGER A

IPC: C23C18/16 ,  G03C1/62 ,  G03F1/54 ,  G03F7/00 ,  G03F7/04 ,  H01L21/00 ,  H05K3/00 ,  H05K3/18 ,  G03C5/00 ,  G03C11/00

CPC classification number: H05K3/185 ,  C23C18/1605 ,  G03C1/62 ,  G03F1/54 ,  G03F7/00 ,  G03F7/04 ,  H01L21/00 ,  H05K3/0002 ,  H05K2203/056

Abstract: A method of producing optical masks by coating one surface of a transparent plate with a photoresist layer containing, as an additive, a catalyst for subsequent electroless deposition. The photoresist layer is exposed to a light pattern which activates the conventional sensitizer contained in the photoresist layer to harden the photoresist in the exposed areas. The photoresist is then treated with a developer which removes the unexposed, unhardened areas, leaving a pattern corresponding to the light pattern of photoresist containing a catalyst for electroless deposition. The substrate is then treated with a conventional electroless deposition bath which selectively deposits the metal in the areas coated with the photoresist pattern.

公开(公告)号：DE1270353B

公开(公告)日：1968-06-12

申请号：DE1270353

申请日：1965-06-08

Applicant: IBM

Inventor： LENOBLE JEAN PAUL ,  ADDY JOHN ,  FORD CHANDLERS ,  PIGGIN BRUCE PAUL

IPC: C03C17/10 ,  C23C18/24 ,  H01B1/00 ,  H01F10/00 ,  H01F41/24 ,  H05K3/18 ,  H05K3/38 ,  B44D1/18

Abstract: A substrate of e.g. synthetic or natural resins, glass, wood, ceramic, paper is coated with a metal, e.g. gold, silver, nickel, chromium, iron, copper or zinc, by chemical deposition after first treating the substrate with a seeding metal compound, e.g. stannous chloride, in a solvent e.g. sulphuric, trichloroacetic or hydrofluoric acids or acetone, which also attacks the surface of the substrate. In an Example a polyesterterephthalate sheet is washed in an aqueous tetrasodium pyrophosphate, detergent and sodium carbonate solution, and then after rinsing immersed in a solution of 900 c.c. of sulphuric acid (conc.), 100 c.c. of hydrochloric acid (conc.), and 0.5 grms. of stannous chloride. The sheet is then rinsed in a sulphuric, hydrochloric acid solution and then in water. After further seeding in another stannous chloride solution, and rinsing, the sheet is immersed in a palladium chloride, hydrochloric acid solution and finally in a copper-plating solution comprising one part of 170 gms. copper sulphate, 189 c.cs. formaldehyde and water to make 1 gallon, and one part of 65 to 70 gms. nickel chloride, 155 to 160 gms. sodium hydroxide, 700 to 750 gms. Rochelle salts, 70 to 75 gms. sodium carbonate and water to make 1 gallon.

公开(公告)号：GB1055073A

公开(公告)日：1967-01-11

申请号：GB2479964

申请日：1964-06-15

Applicant: IBM

Inventor： HUSSEY HUGH HARRY DONALD ,  DAVIES MICHAEL BASIL ,  LENOBLE JEAN PAUL ,  RUSSELL ALAN DAVID

IPC: C23C18/16 ,  G03C5/40 ,  H05K3/10

Abstract: An electrically conductive surface is formed on a base of e.g ceramic, mica, wood, paper, glass or plastics, by partly exposing and developing a silver halide emulsion, removing the exposed part with a bleach-etch solution and then fully exposing and developing the remaining unexposed part. In an example for forming a printed circuit, a film is partly exposed through a negative mask, developed, rinsed, immersed in a bleach-etch solution comprising cupric sulphate, citric acid, potassium bromide, and hydrogen peroxide, reexposed, developed, rinsed, immersed in a similar bleach-etch solution, rinsed, fully exposed, developed, rinsed, and the printed wiring so formed is polished. The wiring may be built up by electroless deposition of copper using an alkaline solution of copper sulphate with formaldehyde. The conductive layer may be baked to remove residues of gelatine, and lacquered to make the surface non-hygroscopic.

公开(公告)号：GB1042816A

公开(公告)日：1966-09-14

申请号：GB2474264

申请日：1964-06-15

Applicant: IBM

Inventor： ADDY JOHN ,  PIGGIN BRUCE PAUL ,  LENOBLE JEAN PAUL

IPC: C03C17/10 ,  C23C18/24 ,  H01B1/00 ,  H01F10/00 ,  H01F41/24 ,  H05K3/18 ,  H05K3/38

Abstract: A substrate of e.g. synthetic or natural resins, glass, wood, ceramic, paper is coated with a metal, e.g. gold, silver, nickel, chromium, iron, copper or zinc, by chemical deposition after first treating the substrate with a seeding metal compound, e.g. stannous chloride, in a solvent e.g. sulphuric, trichloroacetic or hydrofluoric acids or acetone, which also attacks the surface of the substrate. In an Example a polyesterterephthalate sheet is washed in an aqueous tetrasodium pyrophosphate, detergent and sodium carbonate solution, and then after rinsing immersed in a solution of 900 c.c. of sulphuric acid (conc.), 100 c.c. of hydrochloric acid (conc.), and 0.5 grms. of stannous chloride. The sheet is then rinsed in a sulphuric, hydrochloric acid solution and then in water. After further seeding in another stannous chloride solution, and rinsing, the sheet is immersed in a palladium chloride, hydrochloric acid solution and finally in a copper-plating solution comprising one part of 170 gms. copper sulphate, 189 c.cs. formaldehyde and water to make 1 gallon, and one part of 65 to 70 gms. nickel chloride, 155 to 160 gms. sodium hydroxide, 700 to 750 gms. Rochelle salts, 70 to 75 gms. sodium carbonate and water to make 1 gallon.

公开(公告)号：FR94731E

公开(公告)日：1969-10-24

申请号：FR06009025

申请日：1968-02-14

Applicant: IBM FRANCE

Inventor： LENOBLE JEAN PAUL ,  ALBERT BERTRAND ,  COQUARD JACQUES ,  FEIST JEAN-MARC ,  NORTURE ROGER

IPC: G03F7/04 ,  G03C ,  H05K

公开(公告)号：GB1098182A

公开(公告)日：1968-01-10

申请号：GB5104163

申请日：1963-12-27

Applicant: IBM

Inventor： LENOBLE JEAN PAUL ,  PIGGIN BRUCE PAUL ,  SETZER ANTON MAX ,  VAUGHAN ERIC

IPC: C23C18/16 ,  C25D5/02 ,  C25F3/02 ,  C25F3/14 ,  C25F7/00 ,  H05K3/00 ,  H05K3/07 ,  H05K3/10 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

Abstract: Metal is deposited locally on a workpiece by electrolytic or electroless action by using an insulating mask having one or more openings in contact with the workpiece and a porous backing member engaging the surface of the mask remote from the workpiece, a solution for effecting the deposition being present in the backing member and one or more of the openings in the mask. The mask may be formed by a photographic technique using a photo-sensitive resist or sensitized polyvinyl alcohol or nylon and may be adhered to a porous metallic backing. Alternatively a plastics sheet may be coated on to the backing and the masking openings formed in the sheet by mechanical scribing or by an electron or laser beam, or a punched plastic sheet may be secured to the metal backing. The workpiece and mask may be pressed together by flexible pressure bags. In one arrangement, a workpiece sandwiched between two masks is placed inside a bag 46 of rubber or plastic secured to a frame 45 and supported within a pressure applying vessel 40 which also contains a heater 50 and ultrasonic generators 48, 49. If desired the surface of the support member adjacent the mask may be channelled and connected to a supply pipe to allow for forced circulation of an electro-plating electrolyte to which additions may be made externally of the plating chamber. By passing successively different plating and intermediate washing solutions, successive different metal deposits may be provided, e.g. copper followed by gold. In another arrangement the workpiece and mask are held by a pressure bag against a rigid grid on the far side of which is disposed a soluble metal anode. The anode may be bagged or surrounded by a wad of glass fibre in a plastics net. For electro-depositing copper on a copper coated insulator an acid sulphate solution containing potash alum may be used. The copper coating in the unplated area may be removed by treating with acidified dichromate or ferric chloride solution. If the electrodeposited metal is tin-lead alloy from a fluoborate bath or gold the unplated copper coating may be removed with ammonium persulphate or ferric chloride solution respectively. Electroless plating with copper may be effected directly on to an insulating workpiece which has been sensitized by dipping successively in stannous chloride and palladium chloride solutions followed by washing. For printed circuit production conductors of different cross-sections may be deposited by employing a mask having openings of complementary profile. The spaces between the deposited metal may be filled with epoxy resin, cured, ground and polished to provide conducting pins flush with the resin surface and a uniform metal coating may be applied thereover. By so treating both faces of a workpiece a coil or multiple plate capacitor may be formed or connections extending through an insulator produced. In an arrangement for forming an electro-plated printed circuit, a copper coated insulating strip is fed around a porous cylinder bearing an insulating mask and partially immersed in an electrolytic bath, an endless moving belt conveyer holding the copper surface of the strip, to which cathodic connection is made by a roller, against the mask.