公开(公告)号：EP2326903A4

公开(公告)日：2013-01-02

申请号：EP09811958

申请日：2009-08-20

Applicant: IBM

Inventor： BRUNSCHWILER THOMAS ,  LINDERMAN RYAN J ,  ROTHUIZEN HUGO E ,  WAELCHLI RETO

IPC: F28F13/06 ,  H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20781

公开(公告)号：JP2007142390A

公开(公告)日：2007-06-07

申请号：JP2006294961

申请日：2006-10-30

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： MICHEL BRUNO ,  THOMAS J BRUNSCHWILER ,  ROTHUIZEN HUGO E ,  KLOTER URS ,  LINDERMAN RYAN J

IPC: H01L23/473 ,  H05K7/20

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a collision cooling device which is in contact with a microprocessor.
SOLUTION: This invention includes a cooling device comprising parallel return paths and having a lot of collision injection ports closely arranged with spaces adjacent to a collision gap 42. This invention also includes a method for, by using branching hierarchy manifolds alternatively engaged, supplying a cooling agent flow to the collision injection ports with less pressure drop as much as possible. Further, a surface extension structure extending to the collision gap 42 forms a U-shaped micro channel between a single collision injection port and a single exit.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供与微处理器接触的碰撞冷却装置。 解决方案：本发明包括一种冷却装置，该冷却装置包括平行返回路径，并且具有大量碰撞注入口，其紧密地布置有与碰撞间隙42相邻的空间。本发明还包括一种通过使用交替接合的分支层级歧管的方法， 尽可能地以较少的压降将冷却剂流提供给碰撞注入口。 此外，延伸到碰撞间隙42的表面延伸结构在单个碰撞注入口和单个出口之间形成U形微通道。 版权所有（C）2007，JPO＆INPIT