中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.018 seconds)

    Particle-based, anisotropic composite materials for magnetic cores
    3.
    发明专利
    Particle-based, anisotropic composite materials for magnetic cores 未知

    公开(公告)号：AU2020295628A1

    公开(公告)日：2021-10-14

    申请号：AU2020295628

    申请日：2020-06-04

    Applicant: IBM

    Inventor： SRIDHAR ARVIND RAJ MAHANKALI ,  BRUNSCHWILER THOMAS ,  YE SUIYING ,  DEL CARRO LUCA ,  AMMANN JENS OLIVER

    IPC: H01F41/16 ,  H01F1/28 ,  H01F3/08

    Abstract: A magnetic core comprises an anisotropic, composite material, which itself includes a matrix material (e.g., a dielectric, non-magnetic material, preferably a paramagnetic material), and magnetically aligned, ferromagnetic particles. The latter may for instance include micrometer- and/or nanometer-length scale particles. Such particles form chains of particles within the matrix material, wherein the chains form percolation paths of magnetic conduction. The paths extend along a first direction, whereby the chains extend, each, substantially along this first direction, while being distinct and distant from each other along a second direction that is perpendicular to the first direction and, possibly, to a third direction that is perpendicular to both the first direction and the second direction. Necking bridges are preferably formed between the particles. Related devices (e.g., inductor, amplifiers, transformers, etc.) and fabrication methods are also disclosed.

    In den Kühlkörper integrierte Stromversorgung und Stromverteilung für integrierte Schaltungen
    4.
    发明专利
    In den Kühlkörper integrierte Stromversorgung und Stromverteilung für integrierte Schaltungen 未知

    公开(公告)号：DE112011102966T5

    公开(公告)日：2013-06-27

    申请号：DE112011102966

    申请日：2011-10-21

    Applicant: IBM

    Inventor： BAROWSKI HARRY ,  HARRER HUBERT ,  SUPPER JOCHEN ,  MICHEL BRUNO ,  HUBER ANDREAS ,  NIGGEMEIER TIM ,  BRUNSCHWILER THOMAS ,  PAREDES STEPHAN

    IPC: H01L25/18

    Abstract: Es wird ein Mechanismus zur integrierten Stromversorgung und Stromverteilung über einen Kühlkörper bereitgestellt. Der Mechanismus weist eine Prozessorschicht auf, die über eine erste Menge von Verbindungseinheiten mit einer Signalisierungs- und Eingabe/Ausgabe-Schicht (E/A-Schicht) verbunden ist, sowie einen Kühlkörper, der über eine zweite Menge von Verbindungseinheiten mit der Prozessorschicht verbunden ist. Bei dem Mechanismus weist der Kühlkörper eine Vielzahl von Nuten auf, wobei jede Nut entweder einen Pfad für Strom oder einen Pfad für Masse bereitstellt, die der Prozessorschicht zugeführt werden sollen. Bei dem Mechanismus ist der Kühlkörper nur zur Zufuhr von Strom vorgesehen und stellt den Elementen des Mechanismus keine Datenaustauschsignale bereit, und die Signalisierungs- und E/A-Schicht ist nur zum Übertragen der Datenaustauschsignale an die Prozessorschicht und zum Empfangen der Datenaustauschsignale von der Prozessorschicht vorgesehen und stellt den Elementen der Prozessorschicht keinen Strom bereit.

    Heat sink integrated power delivery and distribution for integrated circuits
    6.
    发明专利
    Heat sink integrated power delivery and distribution for integrated circuits 未知

    公开(公告)号：GB2498310B

    公开(公告)日：2014-03-12

    申请号：GB201307552

    申请日：2011-10-21

    Applicant: IBM

    Inventor： BAROWSKI HARRY ,  HUBER ANDREAS ,  HARRER HUBERT ,  NIGGEMEIER TIM ,  SUPPER JOCHEN ,  MICHEL BRUNO ,  BRUNSCHWILER THOMAS ,  PAREDES STEPHAN

    IPC: H01L23/50 ,  H01L23/36

    Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

    OPTIMIZED SEMICONDUCTOR PACKAGING IN A THREE-DIMENSIONAL STACK
    7.
    发明专利
    OPTIMIZED SEMICONDUCTOR PACKAGING IN A THREE-DIMENSIONAL STACK 未知

    公开(公告)号：CA2816184A1

    公开(公告)日：2012-05-03

    申请号：CA2816184

    申请日：2011-10-21

    Applicant: IBM

    Inventor： BAROWSKI HARRY ,  HUBER ANDREAS ,  HARRER HUBERT ,  NIGGEMEIER TIM ,  SUPPER JOCHEN ,  MICHEL BRUNO ,  BRUNSCHWILER THOMAS ,  PAREDES STEPHAN

    IPC: H01L25/065 ,  H01L25/10 ,  H01L25/11

    Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

    Particle-based, anisotropic composite materials for magnetic cores
    8.
    发明专利
    Particle-based, anisotropic composite materials for magnetic cores 未知

    公开(公告)号：AU2020295628B2

    公开(公告)日：2022-08-04

    申请号：AU2020295628

    申请日：2020-06-04

    Applicant: IBM

    Inventor： SRIDHAR ARVIND RAJ MAHANKALI ,  BRUNSCHWILER THOMAS ,  YE SUIYING ,  DEL CARRO LUCA ,  AMMANN JENS OLIVER

    IPC: H01F41/16 ,  H01F1/28 ,  H01F3/08

    Abstract: A magnetic core comprises an anisotropic, composite material, which itself includes a matrix material (e.g., a dielectric, non-magnetic material, preferably a paramagnetic material), and magnetically aligned, ferromagnetic particles. The latter may for instance include micrometer- and/or nanometer-length scale particles. Such particles form chains of particles within the matrix material, wherein the chains form percolation paths of magnetic conduction. The paths extend along a first direction, whereby the chains extend, each, substantially along this first direction, while being distinct and distant from each other along a second direction that is perpendicular to the first direction and, possibly, to a third direction that is perpendicular to both the first direction and the second direction. Necking bridges are preferably formed between the particles. Related devices (e.g., inductor, amplifiers, transformers, etc.) and fabrication methods are also disclosed.

    PARTICLE-BASED, ANISOTROPIC COMPOSITE MATERIALS FOR MAGNETIC CORES
    10.
    发明专利
    PARTICLE-BASED, ANISOTROPIC COMPOSITE MATERIALS FOR MAGNETIC CORES 未知

    公开(公告)号：SG11202110273XA

    公开(公告)日：2021-10-28

    申请号：SG11202110273X

    申请日：2020-06-04

    Applicant: IBM

    Inventor： SRIDHAR ARVIND ,  BRUNSCHWILER THOMAS ,  YE SUIYING ,  DEL CARRO LUCA ,  AMMANN JENS

    IPC: H01F41/16 ,  H01F1/28 ,  H01F3/08

    Abstract: A magnetic core comprises an anisotropic, composite material, which itself includes a matrix material (e.g., a dielectric, non-magnetic material, preferably a paramagnetic material), and magnetically aligned, ferromagnetic particles. The latter may for instance include micrometer- and/or nanometer-length scale particles. Such particles form chains of particles within the matrix material, wherein the chains form percolation paths of magnetic conduction. The paths extend along a first direction, whereby the chains extend, each, substantially along this first direction, while being distinct and distant from each other along a second direction that is perpendicular to the first direction and, possibly, to a third direction that is perpendicular to both the first direction and the second direction. Necking bridges are preferably formed between the particles. Related devices (e.g., inductor, amplifiers, transformers, etc.) and fabrication methods are also disclosed.

Patent Agency Ranking