公开(公告)号：JP2002373923A

公开(公告)日：2002-12-26

申请号：JP2002131146

申请日：2002-05-07

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

Inventor： JACKSON RAYMOND A ,  BRADLEY SCOTT A ,  DELAURENTIS STEPHEN A ,  INTERRANTE MARIO J ,  LINNELL DAVID C

IPC: H01L21/60 ,  B08B1/00 ,  B08B7/00 ,  B23K1/018 ,  H01L21/48 ,  H05K3/34

CPC classification number: B08B1/008 ,  B08B7/0071 ,  H01L21/4864 ,  H05K3/3436 ,  H05K3/3457

Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for removing BGA interconnections from a substrate and an interposer for rework.
SOLUTION: The method for removing at least one molten or solid structure from a surface is provided with the step of placing the surface with the at least one molten or solid structure in a fixture, the step of disposing a wiper block assembly made to act by bias at a region at least proximally to one molten or solid structure, the step of retaining the wiper block assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure, and the step of raising the temperature of the fixture to the first temperature point level. When the device reaches the first temperature point level, at least the one molten or solid structure is wiped off from the surface.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供一种用于从基板和插入件去除BGA互连以进行返工的方法和装置。 解决方案：从表面去除至少一个熔融或固体结构的方法具有将具有至少一个熔融或固体结构的表面放置在固定装置中的步骤，将设置为由 在至少近似于一个熔融或固体结构的区域处的偏压，将刮水块组件保持在第一位置的步骤，其中装置具有等于或高于所述至少一个的第二熔点水平的第一温度点水平 熔融或固体结构，以及将夹具的温度升高到第一温度点的步骤。 当装置达到第一温度点时，至少将一个熔融或固体结构从表面擦掉。

公开(公告)号：CA2114255C

公开(公告)日：1998-08-04

申请号：CA2114255

申请日：1994-01-26

Applicant: IBM

Inventor： BAUER TIBOR L ,  CAVALIERE WILLIAM A ,  GREEN DAVID K ,  KARIDIS JOHN P ,  LINNELL DAVID C

IPC: B65G47/90 ,  B28D5/00 ,  H01L21/677 ,  H01L21/687 ,  H05K13/02 ,  G05D3/00

Abstract: A transfer device especially suitable for transferring a minute electronic component part from a first location and position to a second location and position, the component part having critical facet sides of high integrity and at least one non-critical side, is disclosed. The transfer device comprises an non-destructive engaging means, a control means, and a decoupling means, whereby the integrity of the essential facet sides of the component part is maintained.

公开(公告)号：CA2114255A1

公开(公告)日：1994-09-16

申请号：CA2114255

申请日：1994-01-26

Applicant: IBM

Inventor： BAUER TIBOR L ,  CAVALIERE WILLIAM A ,  GREEN DAVID K ,  KARIDIS JOHN P ,  LINNELL DAVID C

IPC: B65G47/90 ,  B28D5/00 ,  H01L21/677 ,  H01L21/687 ,  H05K13/02 ,  G05D3/00

Abstract: A transfer device especially suitable for transferring a minute electronic component part from a first location and position to a second location and position, the component part having critical facet sides of high integrity and at least one non-critical side, is disclosed. The transfer device comprises an non- destructive engaging means, a control means, and a decoupling means, whereby the integrity of the essential facet sides of the component part is maintained.