公开(公告)号：FR2307437A1

公开(公告)日：1976-11-05

申请号：FR7606740

申请日：1976-03-02

Applicant: IBM

Inventor： HAINING FRANK W ,  KOLLY JOSEPH M ,  LYNCH THOMAS E JR

IPC: H01L23/50 ,  H05K3/06 ,  H05K3/00 ,  H01B13/00

Abstract: A method for making lead frame devices wherein a thin metal foil is adhered to a stiffener panel by means of a photoresist layer to enable all processing steps by which the metal foil is transformed into an appropriate and predetermined lead frame configuration. After the lead frame fabrication is completed, the photoresist is removed by suitable means and ready for application and functional use as an electronic component electrical connecting device.