公开(公告)号：US3421895A

公开(公告)日：1969-01-14

申请号：US3421895D

申请日：1965-12-23

Applicant: IBM

Inventor： HAINING FRANK W ,  HALPERIN BERNARD I ,  THOMPSON JAMES O

IPC: G03C5/18 ,  G03C5/22

CPC classification number: G03C5/18

公开(公告)号：US3154417A

公开(公告)日：1964-10-27

申请号：US16305561

申请日：1961-12-29

Applicant: IBM

Inventor： AEBI CLAUDE M ,  HAINING FRANK W

IPC: G03C1/58

CPC classification number: G03C1/585

公开(公告)号：FR2307437A1

公开(公告)日：1976-11-05

申请号：FR7606740

申请日：1976-03-02

Applicant: IBM

Inventor： HAINING FRANK W ,  KOLLY JOSEPH M ,  LYNCH THOMAS E JR

IPC: H01L23/50 ,  H05K3/06 ,  H05K3/00 ,  H01B13/00

Abstract: A method for making lead frame devices wherein a thin metal foil is adhered to a stiffener panel by means of a photoresist layer to enable all processing steps by which the metal foil is transformed into an appropriate and predetermined lead frame configuration. After the lead frame fabrication is completed, the photoresist is removed by suitable means and ready for application and functional use as an electronic component electrical connecting device.

公开(公告)号：FR2285047A1

公开(公告)日：1976-04-09

申请号：FR7525142

申请日：1975-08-07

Applicant: IBM

Inventor： HAINING FRANK W ,  RUBINO ROBERT V ,  WILEY ROBERT T

IPC: B32B15/04 ,  B29C63/00 ,  B32B15/08 ,  B32B37/00 ,  H01B19/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/22

Abstract: A process for stabilizing printed circuit board substrate or laminate through application of a number of laminate conditioning and baking cycles which function to provide the laminates with dimensional stability. This enables greater control and more precise drilling of the laminates in subsequent fabrication and assembly operations. The dimensional stability for a substrate becomes more critical as the substrate size is increased.

公开(公告)号：CA769669A

公开(公告)日：1967-10-17

申请号：CA769669D

Applicant: IBM

Inventor： HAINING FRANK W ,  HALPERIN BERNARD I ,  THOMPSON JAMES O