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公开(公告)号：AT481734T
公开(公告)日：2010-10-15
申请号：AT03798966
申请日：2003-09-15
Applicant: IBM
Inventor： MACQUARRIE STEPHEN , MEMIS IRVING
Abstract: In an integrated circuit package employing solder bump technology, a metal layer placed on the surface of a substrate below an array of bonding pads is split and displaced from its axis at selected locations to preserve electrical continuity, but to also lower the height of an insulating solder mask layer at those locations.
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