公开(公告)号：FR2356737A1

公开(公告)日：1978-01-27

申请号：FR7714015

申请日：1977-05-03

Applicant: IBM

Inventor： ALPAUGH WARREN A ,  MACUR GEORGE J ,  VLASAK GARY P

IPC: C04B41/88 ,  C23C18/16 ,  H05K3/18 ,  C23C18/28 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C3/02 ,  H05K3/10

Abstract: A three step seeding process with a hot water rinse and bake includes first contacting the surface of a substrate with a stannous chloride sensitizing solution, followed by a hot water rinse to remove any excess stannous chloride. Next, a palladium chloride activator is used to interact with the stannous compounds to form an adherent layer of metallic palladium particles. Thereafter, the surface is subjected to a palladium chloride/stannous chloride/HCL seeder bath which deposits a final catalytic layer on the surface and drilled through holes to facilitate the electroless plating of a metal of the substrate. A subsequent baking at a temperature between 105 DEG C and 120 DEG C sets the seeder on the substrate surface and in the through holes in the substrate.