公开(公告)号：FR2408276A1

公开(公告)日：1979-06-01

申请号：FR7828927

申请日：1978-10-02

Applicant: IBM

Inventor： BABCOCK THOMAS C ,  THERON ,  ELLIS L ,  MAJKA HENRY C

IPC: C23G5/02 ,  H05K3/38 ,  H05K3/46 ,  H05K3/26

Abstract: Subsequent to the additive plating of copper circuitry on a substrate and prior to further steps such as lamination to form a multilayer printed circuit board, a sequence of etching and cleaning steps are used to improve the lamination strength of the additively plated copper. The circuitized substrate is dipped in an etchant bath and then baked at an elevated temperature for 2-4 hours. Following this the circuitized substrate is washed with an organic cleaner, water rinsed and air dried. Thereafter a chlorite oxide layer is added to the circuitized substrate and it is ready for further processing.

公开(公告)号：CA1094929A

公开(公告)日：1981-02-03

申请号：CA313822

申请日：1978-10-20

Applicant: IBM

Inventor： BABCOCK THOMAS C ,  ELLIS THERON L ,  MAJKA HENRY C

IPC: H05K3/46 ,  C23G5/02 ,  H05K3/38 ,  C23F1/00 ,  C03C23/00 ,  C23G1/00

Abstract: ADHESION PROMOTER FOR ADDITIVELY PLATED PRINTED CIRCUIT BOARDS Subsequent to the additive plating of copper circuitry on a substrate and prior to further steps such as lamination to form a multilayer printed circuit board, a sequence of etching and cleaning steps are used to improve the lamination strength of the additively plated copper. The circuitized substrate is dipped in an etchant bath and then baked at an elevated temperature for 2-4 hours. Following this the circuitized substrate is washed with an organic cleaner, water rinsed and air dried. Thereafter a chlorite oxide layer is added to the circuitized substrate and it is ready for further processing. EN9-77-003 DLM/M14