公开(公告)号：DE3781086T2

公开(公告)日：1993-03-18

申请号：DE3781086

申请日：1987-10-13

Applicant: IBM

Inventor： CHAN KEVIN KOK ,  MALUEG VICKI JEAN

IPC: C09J5/00 ,  B05D7/24 ,  B32B38/00 ,  C09J5/02 ,  C23C24/00 ,  H05K3/38 ,  H05K3/44 ,  H05K3/46 ,  C23F4/00 ,  B32B31/12

Abstract: A method for promoting the adhesion of a polymer such as as an epoxy resin to a metal such as copper wherein the metal surface to be adhered is sequentially exposed to a pressurized stream of a slurry containing suspended metal oxide particles followed by treating the metal oxide treated film in a gas plasma containing a fluorohydrocarbon.

公开(公告)号：DE3781086D1

公开(公告)日：1992-09-17

申请号：DE3781086

申请日：1987-10-13

Applicant: IBM

Inventor： CHAN KEVIN KOK ,  MALUEG VICKI JEAN

IPC: C09J5/00 ,  B05D7/24 ,  B32B38/00 ,  C09J5/02 ,  C23C24/00 ,  H05K3/38 ,  H05K3/44 ,  H05K3/46 ,  C23F4/00 ,  B32B31/12

Abstract: A method for promoting the adhesion of a polymer such as as an epoxy resin to a metal such as copper wherein the metal surface to be adhered is sequentially exposed to a pressurized stream of a slurry containing suspended metal oxide particles followed by treating the metal oxide treated film in a gas plasma containing a fluorohydrocarbon.