公开(公告)号：DE19515346C2

公开(公告)日：1997-04-17

申请号：DE19515346

申请日：1995-04-26

Applicant: IBM

Inventor： CABRAL JUN CYRIL ,  CHAN KEVIN KOK ,  CHU JACK OON ,  HARPER JAMEX MCKELL EDWIN

IPC: C30B29/06 ,  C23C14/08 ,  C23C16/04 ,  H01L21/20 ,  H01L21/203 ,  H01L21/205 ,  C30B25/04 ,  C30B23/04 ,  C30B29/08 ,  C30B29/36

Abstract: Epitaxial and polycrystalline layers of silicon and silicon-germanium alloys are selectively grown on a semiconductor substrate or wafer by forming over the wafer a thin film masking layer of an oxide of element selected from scandium, yttrium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium and then growing the epitaxial layer over the wafer at temperatures below 650 DEG C. The epitaxial and polycrystalline layers do not grow on the masking layer. The invention overcomes the problem of forming epitaxial layers at temperatures above 650 DEG C. by providing a lower temperature process.

公开(公告)号：DE19515346A1

公开(公告)日：1995-11-23

申请号：DE19515346

申请日：1995-04-26

Applicant: IBM

Inventor： CABRAL JUN CYRIL ,  CHAN KEVIN KOK ,  CHU JACK OON ,  HARPER JAMEX MCKELL EDWIN

IPC: C30B29/06 ,  C23C14/08 ,  C23C16/04 ,  H01L21/20 ,  H01L21/203 ,  H01L21/205 ,  C30B25/04 ,  C30B23/04

Abstract: Epitaxial and polycrystalline layers of silicon and silicon-germanium alloys are selectively grown on a semiconductor substrate or wafer by forming over the wafer a thin film masking layer of an oxide of element selected from scandium, yttrium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium and then growing the epitaxial layer over the wafer at temperatures below 650 DEG C. The epitaxial and polycrystalline layers do not grow on the masking layer. The invention overcomes the problem of forming epitaxial layers at temperatures above 650 DEG C. by providing a lower temperature process.

公开(公告)号：DE3781086T2

公开(公告)日：1993-03-18

申请号：DE3781086

申请日：1987-10-13

Applicant: IBM

Inventor： CHAN KEVIN KOK ,  MALUEG VICKI JEAN

IPC: C09J5/00 ,  B05D7/24 ,  B32B38/00 ,  C09J5/02 ,  C23C24/00 ,  H05K3/38 ,  H05K3/44 ,  H05K3/46 ,  C23F4/00 ,  B32B31/12

Abstract: A method for promoting the adhesion of a polymer such as as an epoxy resin to a metal such as copper wherein the metal surface to be adhered is sequentially exposed to a pressurized stream of a slurry containing suspended metal oxide particles followed by treating the metal oxide treated film in a gas plasma containing a fluorohydrocarbon.

公开(公告)号：DE3781086D1

公开(公告)日：1992-09-17

申请号：DE3781086

申请日：1987-10-13

Applicant: IBM

Inventor： CHAN KEVIN KOK ,  MALUEG VICKI JEAN

IPC: C09J5/00 ,  B05D7/24 ,  B32B38/00 ,  C09J5/02 ,  C23C24/00 ,  H05K3/38 ,  H05K3/44 ,  H05K3/46 ,  C23F4/00 ,  B32B31/12

Abstract: A method for promoting the adhesion of a polymer such as as an epoxy resin to a metal such as copper wherein the metal surface to be adhered is sequentially exposed to a pressurized stream of a slurry containing suspended metal oxide particles followed by treating the metal oxide treated film in a gas plasma containing a fluorohydrocarbon.