公开(公告)号：DE69506829T2

公开(公告)日：1999-08-05

申请号：DE69506829

申请日：1995-10-17

Applicant: IBM

Inventor： BEETESON JOHN ,  MARTIN FRANK JOHN

IPC: H01J29/89 ,  C09J5/06 ,  B29C65/00

公开(公告)号：GB2294234A

公开(公告)日：1996-04-24

申请号：GB9421238

申请日：1994-10-21

Applicant: IBM

Inventor： BEETESON JOHN ,  MARTIN FRANK JOHN

IPC: H01J29/89 ,  H01J29/87

公开(公告)号：GB2308560B

公开(公告)日：1999-06-23

申请号：GB9526504

申请日：1995-12-23

Applicant: IBM

Inventor： MARTIN FRANK JOHN ,  ROBERTSON BRIAN

IPC: B23K1/19 ,  H05K3/34 ,  B23K1/00

Abstract: A method for increasing the strength of a solder joint between a nickel-iron lead frame of an electronic circuit module and a copper pad of a printed circuit board on which the module is mounted includes baking the joint for at least one hour at a temperature in the range 373K to 456K. The baking step is found to significantly increase the strength of the joint.

公开(公告)号：DE69506829D1

公开(公告)日：1999-02-04

申请号：DE69506829

申请日：1995-10-17

Applicant: IBM

Inventor： BEETESON JOHN ,  MARTIN FRANK JOHN

IPC: H01J29/89 ,  C09J5/06 ,  B29C65/00

公开(公告)号：GB2308560A

公开(公告)日：1997-07-02

申请号：GB9526504

申请日：1995-12-23

Applicant: IBM

Inventor： MARTIN FRANK JOHN ,  ROBERTSON BRIAN

IPC: B23K1/19 ,  H05K3/34 ,  B23K1/00

Abstract: A method for increasing the strength of a solder joint between a nickel-iron lead frame of an electronic circuit module and a copper pad of a printed circuit board on which the module is mounted includes baking the joint for at least one hour at a temperature in the range 373K to 456K. The baking step is found to significantly increase the strength of the joint.