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公开(公告)号：GB2308560B
公开(公告)日：1999-06-23
申请号：GB9526504
申请日：1995-12-23
Applicant: IBM
Inventor： MARTIN FRANK JOHN , ROBERTSON BRIAN
Abstract: A method for increasing the strength of a solder joint between a nickel-iron lead frame of an electronic circuit module and a copper pad of a printed circuit board on which the module is mounted includes baking the joint for at least one hour at a temperature in the range 373K to 456K. The baking step is found to significantly increase the strength of the joint.
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公开(公告)号：GB2289235A
公开(公告)日：1995-11-15
申请号：GB9409000
申请日：1994-05-06
Applicant: IBM
Inventor： FRENCH WILLIAM , LEES STUART , MCCALL COLIN DAVID , MURRAY KENNETH SKENE , ROBERTSON BRIAN
Abstract: A tool for soldering pin-in-hole electronic circuit components includes a tool plate (10) with a set of holes (15) corresponding to the vias of a circuit board on which a circuit component is to be soldered. The board is aligned with the tool plate and hot gas is supplied through the set of holes to reflow solder in the vias. The tool is particularly suitable for use in removing a replacing circuit components. Use of particular gases allows soldering to be carried out without use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board.
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公开(公告)号：GB2308560A
公开(公告)日：1997-07-02
申请号：GB9526504
申请日：1995-12-23
Applicant: IBM
Inventor： MARTIN FRANK JOHN , ROBERTSON BRIAN
Abstract: A method for increasing the strength of a solder joint between a nickel-iron lead frame of an electronic circuit module and a copper pad of a printed circuit board on which the module is mounted includes baking the joint for at least one hour at a temperature in the range 373K to 456K. The baking step is found to significantly increase the strength of the joint.
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