公开(公告)号：JPH10296618A

公开(公告)日：1998-11-10

申请号：JP10900898

申请日：1998-04-20

Applicant: IBM

Inventor： MATTHEW KIRKPATRICK MILLER ,  MATTHEW JEREMY RUTON ,  WRIGHT TERRANCE M

IPC: B24B37/10 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a machine and method to chemically and mechanically polish(CMP) semiconductor wafers. SOLUTION: At least one polishing device is provided with a polishing pad polishing face, which can be rotated and is perpendicularly oriented, and a slurry supply mechanism 20. A semiconductor wafer is provided so that it is received by a wafer carrier 40 from a holder/cassette and can be held contacting the polishing area 2 of the polishing pad in parallel with each other. A conditioning module 30 securing a spring 31 can be provided in the area next to the polishing area 2 to clean/condition the polishing pad. In this case, slurry drops through an exit 26 from a slurry conduit 24 and uniformly expanded by a squeeze 22. In such constitution. The floor space for machine installation is substantially reduced, as a result, the prevention of sticking of pollutants to the polishing machine can be promoted.