公开(公告)号：FR2303446A1

公开(公告)日：1976-10-01

申请号：FR7602209

申请日：1976-01-20

Applicant: IBM

Inventor： MEEKER ROBERT G ,  SCANLON WILLIAM J ,  SEGAL ZVI

IPC: H01L21/677 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  H01L23/34 ,  H05K13/08

Abstract: The invention relates to apparatus for the testing of high circuit density devices fabricated by large scale integration techniques. More specifically, the invention is directed to a test fixture used in a test system for determining the merit or electrical integrity of small semiconductor chips, diced from a semiconductor wafer having a large number of chips. Each chip being a high circuit density device, e.g., a small monolithic semiconductor structure having a large number of closely spaced circuits thereon and therein.

公开(公告)号：CA1097788A

公开(公告)日：1981-03-17

申请号：CA305890

申请日：1978-06-20

Applicant: IBM

Inventor： MEEKER ROBERT G ,  SCANLON WILLIAM J ,  SEGAL ZVI

IPC: H05K7/20 ,  F25D9/00 ,  H01L23/433 ,  H01L23/44 ,  H01L23/473 ,  H01L23/24

Abstract: IMPROVED GAS ENCAPSULATED COOLING MODULE of the Disclosure A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.