公开(公告)号：FR2303446A1

公开(公告)日：1976-10-01

申请号：FR7602209

申请日：1976-01-20

Applicant: IBM

Inventor： MEEKER ROBERT G ,  SCANLON WILLIAM J ,  SEGAL ZVI

IPC: H01L21/677 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  H01L23/34 ,  H05K13/08

Abstract: The invention relates to apparatus for the testing of high circuit density devices fabricated by large scale integration techniques. More specifically, the invention is directed to a test fixture used in a test system for determining the merit or electrical integrity of small semiconductor chips, diced from a semiconductor wafer having a large number of chips. Each chip being a high circuit density device, e.g., a small monolithic semiconductor structure having a large number of closely spaced circuits thereon and therein.

公开(公告)号：CA1097788A

公开(公告)日：1981-03-17

申请号：CA305890

申请日：1978-06-20

Applicant: IBM

Inventor： MEEKER ROBERT G ,  SCANLON WILLIAM J ,  SEGAL ZVI

IPC: H05K7/20 ,  F25D9/00 ,  H01L23/433 ,  H01L23/44 ,  H01L23/473 ,  H01L23/24

Abstract: IMPROVED GAS ENCAPSULATED COOLING MODULE of the Disclosure A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.

公开(公告)号：DE2608642A1

公开(公告)日：1976-09-16

申请号：DE2608642

申请日：1976-03-03

Applicant: IBM

Inventor： MEEKER ROBERT GLEN ,  SCANLON WILLIAM JOSEPH ,  SEGAL ZVI

IPC: H01L21/677 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  H01L23/34

Abstract: The invention relates to apparatus for the testing of high circuit density devices fabricated by large scale integration techniques. More specifically, the invention is directed to a test fixture used in a test system for determining the merit or electrical integrity of small semiconductor chips, diced from a semiconductor wafer having a large number of chips. Each chip being a high circuit density device, e.g., a small monolithic semiconductor structure having a large number of closely spaced circuits thereon and therein.

公开(公告)号：DE2861901D1

公开(公告)日：1982-08-05

申请号：DE2861901

申请日：1978-09-09

Applicant: IBM

Inventor： MEEKER ROBERT GLEN ,  SCANLON WILLIAM JOSEPH ,  SEGAL ZVI

IPC: H05K7/20 ,  F25D9/00 ,  H01L23/433 ,  H01L23/44 ,  H01L23/473 ,  H01L23/42 ,  H01L23/46

Abstract: A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.

公开(公告)号：CA958427A

公开(公告)日：1974-11-26

申请号：CA135897

申请日：1972-03-01

Applicant: IBM

Inventor： SEGAL ZVI

IPC: H01L21/68

Abstract: Aligning and orienting apparatus for semiconductor chip handling apparatus. The aligner and orienter are positioned at one of the handling apparatus stations coacting with an indexable vacuum pencil spider assembly. The pencils under pneumatic control pick up semiconductor chips from bowls and transport them to the aligning and orienting station and then for subsequent handling such as testing and sorting based on the test results. Aligning and orienting is performed by activatable arms carrying aligners at corresponding coacting ends acting on the surfaces of the chip.