公开(公告)号：DE2608642A1

公开(公告)日：1976-09-16

申请号：DE2608642

申请日：1976-03-03

Applicant: IBM

Inventor： MEEKER ROBERT GLEN ,  SCANLON WILLIAM JOSEPH ,  SEGAL ZVI

IPC: H01L21/677 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  H01L23/34

Abstract: The invention relates to apparatus for the testing of high circuit density devices fabricated by large scale integration techniques. More specifically, the invention is directed to a test fixture used in a test system for determining the merit or electrical integrity of small semiconductor chips, diced from a semiconductor wafer having a large number of chips. Each chip being a high circuit density device, e.g., a small monolithic semiconductor structure having a large number of closely spaced circuits thereon and therein.

公开(公告)号：DE3265148D1

公开(公告)日：1985-09-12

申请号：DE3265148

申请日：1982-03-09

Applicant: IBM

Inventor： CRAWFORD DAVID JAMES ,  MEEKER ROBERT GLEN

IPC: H05K13/02 ,  B23P19/02 ,  G05G7/02 ,  G05G23/00 ,  H01R13/629 ,  H05K3/30

Abstract: An apparatus and method are disclosed for precisely positioning an object such as a circuit module (12, 108) by moving it a fixed distance from an unknown initial position, for the purpose, for example, of moving connector pins a fixed distance into associated socket connector springs (136). A resilient spring (40, 42, 100) is compressed between a fixed stop (18, 20, 90) and a member (48, 106) which engages the object; so that the object is moved an unknown distance (A, B, C) to an initial position determined by its encountering resistance which exceeds the force applied by the spring, such as the resistance provided by connector springs when connector pins are inserted. The compression existing in the bias spring is maintained when the initial position is reached while concurrently the engaging member (48, 106) is moved a fixed distance from the initial position, such as the desired insertion distance of connector pins into connector springs. A wedge (64, 124) and lever (72-84, 124-134) linkage maintains the spring compression while moving the engaging member.

公开(公告)号：DE2861901D1

公开(公告)日：1982-08-05

申请号：DE2861901

申请日：1978-09-09

Applicant: IBM

Inventor： MEEKER ROBERT GLEN ,  SCANLON WILLIAM JOSEPH ,  SEGAL ZVI

IPC: H05K7/20 ,  F25D9/00 ,  H01L23/433 ,  H01L23/44 ,  H01L23/473 ,  H01L23/42 ,  H01L23/46

Abstract: A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.