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公开(公告)号:JPH06168556A
公开(公告)日:1994-06-14
申请号:JP18136393
申请日:1993-07-22
Applicant: IBM
Inventor: ROBAATO EDOWAADO FUONTANA JIYU , RINDA HOOPU REEN , MEESON RAMAA UIRIAMUSU ZA SAAD , SERIA ERIZABESU IIKUUSUKURANTO
Abstract: PURPOSE: To manufacture a disk device assembly of very small volume enabling contact recording by integrating a suspension part section and a read/write converter to a combined assembly and manufacturing it by a thin film sticking technique. CONSTITUTION: In one embodiment, a converter 25 is stuck to a releasing layer and a supporting layer covering a wafer substrate with the same thickness as the length of a desired suspension part section 26 by row/column structure. In another embodiment, the wafer substance has the same thickness as the width of the section 26. The converter 25 which is stuck to a row section is separated by the length of the desired section 26 in order to generate the combined assembly 22 useful for the actuator of a linear disk device.