公开(公告)号：MY115354A

公开(公告)日：2003-05-31

申请号：MYPI9501094

申请日：1995-04-26

Applicant: IBM

Inventor： CALL ANSON JAY ,  MEISNER STEPHEN H ,  POMPEO FRANK LOUIS ,  ZITZ JEFFREY ALLEN

IPC: H01L23/40 ,  H05K3/34 ,  H01L21/58 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L23/64

Abstract: THE PRESENT INVENTION RELATES GENERALLY TO A NEW APPARATUS AND METHOD FOR DIRECTLY JOINING A CHIP (20) TO A HEAT SINK (10, 70, 170). MORE PARTICULARLY, THE INVENTION ENCOMPASSES AN APPARATUS AND A METHOD THAT USES A DOUBLE-SIDED, PRESSURE-SENSITIVE, THERMALLY-CONDUCTIVE ADHESIVE TAPE (42) TO DIRECTLY JOIN A CHIP OR SIMILAR SUCH DEVICE TO A HEAT SINK.

公开(公告)号：SG63520A1

公开(公告)日：1999-03-30

申请号：SG1995000347

申请日：1995-04-27

Applicant: IBM

Inventor： CALL ANSON JAY ,  POMPEO FRANK LOUIS ,  ZITZ JEFFREY ALLEN ,  MEISNER STEPHEN H

IPC: H01L23/40 ,  H01L21/58 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L23/64 ,  H01L23/36

Abstract: The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink.