公开(公告)号：WO03012867A2

公开(公告)日：2003-02-13

申请号：PCT/GB0203436

申请日：2002-07-26

Applicant: IBM ,  IBM UK

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

Abstract translation: 结合有EMI屏蔽的电子封装，特别是包含嵌入有接地带的半导体芯片载体结构的半导体器件，其适于减少用于高速开关电子封装的输出和事件EMI发射。

公开(公告)号：MY126247A

公开(公告)日：2006-09-29

申请号：MYPI20022733

申请日：2002-07-18

Applicant: IBM

Inventor： ALCOE DAVID JANES ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE L ,  ZITZ JEFFREY ALLEN ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO J ,  PETERSON BRENDA LEE ,  SHANNON MEGAN J ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD

IPC: H01L23/29 ,  H01L23/552 ,  H01L23/31 ,  H05K9/00

Abstract: ELECTRONIC PACKAGES INCORPORATING EMI SHIELDING, AND PARTICULARLY SEMICONDUCTOR DEVICES WHICH INCORPORATED SEMICONDUCTOR CHIP-CARRIER STRUCTURES HAVING GROUNDED BANDS EMBEDDED THEREIN WHICH ARE ADAPTED TO REDUCE OUTGOING AND INCLUDENT EMI EMISSIONS FOR HIGH-SPEED SWITCHING ELECTRONIC PACKAGES. (FIG. 1)

公开(公告)号：SG63520A1

公开(公告)日：1999-03-30

申请号：SG1995000347

申请日：1995-04-27

Applicant: IBM

Inventor： CALL ANSON JAY ,  POMPEO FRANK LOUIS ,  ZITZ JEFFREY ALLEN ,  MEISNER STEPHEN H

IPC: H01L23/40 ,  H01L21/58 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L23/64 ,  H01L23/36

Abstract: The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink.

公开(公告)号：DE102021125607A1

公开(公告)日：2022-05-19

申请号：DE102021125607

申请日：2021-10-04

Applicant: IBM

Inventor： SIKKA KAMAL K ,  LI SHIDONG ,  SINHA TUHIN ,  ZITZ JEFFREY ALLEN

IPC: H01L23/62 ,  H01L23/34 ,  H01L25/16

Abstract: Eine Chip-Packung weist einen Chip mit einem ersten Temperatursensor auf. Der erste Temperatursensor ist so konfiguriert, dass er eine erste Temperatur des Chips in einem lokalisierten Gebiet um den ersten Temperatursensor herum misst. Die Chip-Packung weist außerdem einen Chip-Träger auf, der über eine Mehrzahl von Lot-Verbindungen mit dem Chip gekoppelt ist. Der Chip-Träger weist einen zweiten Temperatursensor auf, der in Bezug auf den ersten Temperatursensor vertikal ausgerichtet ist. Der zweite Temperatursensor ist so konfiguriert, dass er eine zweite Temperatur des Chip-Trägers in einem lokalisierten Gebiet um den zweiten Temperatursensor herum misst. Der Chip-Träger weist des Weiteren ein lokalisiertes Heizelement auf, das sich in der Nähe des zweiten Temperatursensors befindet und so konfiguriert ist, dass es in Reaktion auf einen detektierten Unterschied auf Grundlage des Vergleichs der ersten Temperatur und der zweiten Temperatur Wärme erzeugt, so dass der detektierte Unterschied in dem lokalisierten Gebiet um den ersten Temperatursensor herum eingestellt wird.

公开(公告)号：HU0401737A2

公开(公告)日：2004-12-28

申请号：HU0401737

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00 ,  H01L23/66

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

公开(公告)号：PL367099A1

公开(公告)日：2005-02-21

申请号：PL36709902

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

公开(公告)号：MY115354A

公开(公告)日：2003-05-31

申请号：MYPI9501094

申请日：1995-04-26

Applicant: IBM

Inventor： CALL ANSON JAY ,  MEISNER STEPHEN H ,  POMPEO FRANK LOUIS ,  ZITZ JEFFREY ALLEN

IPC: H01L23/40 ,  H05K3/34 ,  H01L21/58 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L23/64

Abstract: THE PRESENT INVENTION RELATES GENERALLY TO A NEW APPARATUS AND METHOD FOR DIRECTLY JOINING A CHIP (20) TO A HEAT SINK (10, 70, 170). MORE PARTICULARLY, THE INVENTION ENCOMPASSES AN APPARATUS AND A METHOD THAT USES A DOUBLE-SIDED, PRESSURE-SENSITIVE, THERMALLY-CONDUCTIVE ADHESIVE TAPE (42) TO DIRECTLY JOIN A CHIP OR SIMILAR SUCH DEVICE TO A HEAT SINK.

公开(公告)号：AU2002319480A1

公开(公告)日：2003-02-17

申请号：AU2002319480

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  WEISMAN RENEE ,  INTERRANTE MARIO ,  COFFIN JEFFREY THOMAS ,  STUTZMAN RANDALL JOSEPH ,  GAYNES MICHAEL ANTHONY ,  SPRING CHRISTOPHER TODD ,  PETERSON BRENDA LEE ,  SABLINSKI WILLIAM EDWARD ,  SHANNON MEGAN ,  HAMEL HARVEY CHARLES ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.