1.
    发明专利
    未知

    公开(公告)号:BR8002526A

    公开(公告)日:1980-12-30

    申请号:BR8002526

    申请日:1980-04-24

    Applicant: IBM

    Abstract: A method for high resolution maskless chemical and electrochemical machining is described. Preferential etching results from exposing those regions where machining is sought to an energy beam. Such exposures can increase the ething rate in the case of electrochemical machining by a factor of 103 to 104. Such enhancement is sufficient to make masking unnecessary.

    4.
    发明专利
    未知

    公开(公告)号:BR8002800A

    公开(公告)日:1980-12-16

    申请号:BR8002800

    申请日:1980-05-06

    Applicant: IBM

    Inventor: GUTFELD R MELCHER R

    Abstract: A method for high resolution maskless electroplating is described. Preferential plating results from exposing those regions where enhanced plating is sought to a collimated energy beam. Such exposure can produce an enhancement in the plating rate of 103, which is sufficient to eliminate the necessity of masking the surface.

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