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    Method for completely filling small diameter through-holes with large length to diameter ratio
    1.
    发明授权
    Method for completely filling small diameter through-holes with large length to diameter ratio 失效
    完全填充大直径直径的小直径孔的方法

    公开(公告)号：US3798136A

    公开(公告)日：1974-03-19

    申请号：US3798136D

    申请日：1972-06-09

    Applicant: IBM

    Inventor： OLSEN J ,  ROMANKIW L

    IPC: H05K3/40 ,  C25D5/00 ,  C25D5/16 ,  C25D7/00 ,  C25D7/04 ,  H05K1/03 ,  H05K3/42 ,  C23B5/48 ,  C23B5/56

    CPC classification number: H05K3/423 ,  C25D7/04 ,  H05K1/0306 ,  H05K2203/1518

    Abstract: A METHOD AND APPARATUS FOR PLATING THROUGH LARGE LENGTH TO DIAMETER RATIO HOLES IN A SUBSTRATE IS DISCLOSED. THE METHOD CONSISTS OF FORMING HOLES IN A SUBSTRATE WHICH ARE TAPERED EITHER BY ELECTRON BEAM, OR LASER DRILLING, OR BY FORCING AN APPROPRIATE ETCHANT THROUGH A PREVIOUSLY DRILLED HOLE. THE SUBSTRATE MAY BE OF ANY MATERIAL AND CAN BE EITHER INSULATING OR CONDUCTIVE. IN THE INSTANCE OF THE FORMER, THE SUBSTRATE SHOULD BE OF SUCH A CHARACTER THAT IT IS AMENDABLE TO ELECTROLESS PLATING OR OTHER SURFACE METALLIZING TECHNIQUES. AFTER METALLIZING THE TAPERED HOLE WHERE THE SUBSTRATE IS CONDUCTIVE. THE INTERIORS OF THE TAPERED HOLES ARE ELECTROPLATED WHILE SIMULTANEOUSLY SUBJECTING THE TAPERED PORTION TO AGITATION BY FORCED CONVECTION. USING A PRIOR ART PLATING SOLUTION OF HIGH THROWING POWER, AND FORCING IT THROUGH THE TAPERED HOLES FROM THE LARGE END TOWARD THE SMALL END, CAUSING RELATIVELY HIGH DEPOSITION RATES AT THE WIDEST PORTION OF THE TAPER WHICH GRADUALLY DECREASE ALONG THE LENGTH OF THE TAPER UNTIL THE NARROW PORTION IS REACHED WHERE THE MINIMUM DEPOSITION RATE OCCURS. UNDER SUCH CIRCUMSTANCES, PLATING OCCURS NON-UNIFORMLY ALONG THE LENGTH OF THE TAPER SUCH THAT THE TAPERED HOLES ARE SUBSTANTIALLY CLOSED WITHOUT LEAVING LARGE, UNWANTED VOIDS WHICH CONTRIBUTE TO POOR CONDUCTIVITY, CHARACTERISTICS. THE LENGTH OF HOLES WHICH MAY BE FILLED CAN BE DOUBLED BY PROVIDING A TAPER WHICH DECREASES TOWARD THE MIDPOINT OF A SUBSTRATE AND FROM THERE INCREASES IN SIZE UNTIL THE OPPOSITE SIDE OF THE SUBSTRATE IS REACHED. USING THE SAME ELECTROPLATING SOLUTION OF HIGH THROWING POWER, PLATING THRUGH HOLES OF THIS CHARACTER CAN BE ACCOMPLISHED WHILE PERIODICALLY REVERSING THE DIRECTION OF FLOW TRUGH THE "DOUBLE TAPER" HOLES. APPARATUS FOR CARRYING OUT THE ABOVE DESCRIBED METHOD CONSISTS OF AN ENCLOSED CHAMBER HAVING INLET AND OUTLET PORTS THRUGH WHICH PLATING SOLUTION UNDER PRESSURE CAN BE FORCED. ANODES CONSISTING OF WIRE MESH ARE DISPOSED ADJACENT TO BOTH THE INLET AND OUTLET PORTS WHILE AN ELEMENT CONTAINING HOLES WHICH ARE TO BE PLATED-THROUGH FORMS THE CATHODE AND IS DISPOSED INTERMEDIATE THE ANODES. WHERE A SINGLE TAPER US USED, ELECTROPLATING SOLUTION IS FORCED IN ONE DIRECTION BUT, WHERE A "DOUBLE TAPER" IS UTILIZED, THE FLOW OF ELECTROPLATING SOLUTION IS PERIODICALLY REVERSED. THE METHOD AND APPARATUS OF THE PRESENT INVENTION PROVIDES COMPLETELY PLATED THRUGH-HOLES WHICH HAVE A LENGTH TO DIAMETER IN EXCESS OF 25 AND, IN ADDITION, HAVE EXTREMELY GOOD CONDUCTIVITY CHARACTERISTICS.

    4.
    发明专利
    未知

    公开(公告)号：BR7505283A

    公开(公告)日：1976-08-03

    申请号：BR7505283

    申请日：1975-08-19

    Applicant: IBM

    Inventor： ROMANKIW L

    IPC: G11B5/11 ,  G11B5/265 ,  G11B5/31 ,  G11B5/39 ,  G11B5/12

    Abstract: A thin film head includes a permeable substrate providing a first shield, which may include a more highly permeable layer on its upper surface for shielding, a layer of permeable material thereon providing a second shield and a first write head leg referred to as the shielding-leg layer and a magnetic gap filled with dielectric material between the substrate and the shielding-leg layer. A magnetoresistive stripe including permeable material extends within the dielectric in said gap near the tip end of the head spaced from the substrate and the shielding-leg layer. An inductive single turn or multiturn writing winding is formed upon a layer of dielectric on the other side of the shielding-leg layer. A second leg layer covers the half of the spiral winding towards the tip end of the head and extends through an opening into contact with the shielding-leg layer.

    5.
    发明专利
    未知

    公开(公告)号：BR8002526A

    公开(公告)日：1980-12-30

    申请号：BR8002526

    申请日：1980-04-24

    Applicant: IBM

    Inventor： ROMANKIW L ,  MELCHER R ,  GUTFELD R

    IPC: H05K3/06 ,  B23K26/12 ,  C23F1/02 ,  C23F4/00 ,  C25F3/14 ,  H01L21/306 ,  H01L21/3213 ,  H05K3/22 ,  B23P1/04

    Abstract: A method for high resolution maskless chemical and electrochemical machining is described. Preferential etching results from exposing those regions where machining is sought to an energy beam. Such exposures can increase the ething rate in the case of electrochemical machining by a factor of 103 to 104. Such enhancement is sufficient to make masking unnecessary.

    TRANSDUCER HEAD AND METHOD OF MANUFACTURE
    6.
    发明专利
    TRANSDUCER HEAD AND METHOD OF MANUFACTURE 未知

    公开(公告)号：CA936956A

    公开(公告)日：1973-11-13

    申请号：CA113586

    申请日：1971-05-21

    Applicant: IBM

    Inventor： ROMANKIW L ,  WARDLY G

    IPC: G11B5/17 ,  G11B5/31

    Abstract: A rectangular thin film transducer head includes a magnetic core composed of overlapping laminations of permalloy film joined together magnetically and electrically, near an air gap, at one end of the rectangle, between the two laminations, which gap couples flux to the magnetic recording medium. Two electrically parallel insulated thin film copper windings starting at the end opposite the gap are deposited about the core joining electrically at the end adjacent to the gap to a conductor coupled to both permalloy laminations which conduct return current through the legs of the core inside of the windings. Alternatively, a single series winding passes around the core and through the gap. The head is manufactured by means of photolithographic, vacuum, and thin film techniques.

    8.
    发明专利
    未知

    公开(公告)号：BR7310254D0

    公开(公告)日：1974-08-15

    申请号：BR1025473

    申请日：1973-12-28

    Applicant: IBM

    Inventor： THOMPSON D ,  BAJOREK C ,  ROMANKIW L

    IPC: G01R33/02 ,  G01R33/09 ,  G11B5/39 ,  G11C11/14 ,  H01F10/08 ,  H01F10/32 ,  H04R13/00

    Abstract: 1450204 Magnetic heads INTER. NATIONAL BUSINESS MACHINES CORP 9 Nov 1973 [29 Dec 1972] 52064/73 Heading G5R [Also in Division H3] A magnetic sensing head comprises a unitary structure of a layer of magneto-resistive material 16 for sensing a magnetic field and an adjacent biasing layer 14 of permantly magnetized material to bias the layer 16 magnetically to a required operating range, layers 14 and 16 being in direct contact with one another. The layers 14 and 16 may be co-planar or laminated, with the direction of magnetization, arrow M h , of bias layer 14 parallel or perpendicular to the easy axis and sense current direction, arrow I, of layer 16. Layer 16 is of permalloy material, e.g. Ni-Fe, Ni-Co or Ni-Fe-Co, and the bias layer 14 may be of ferrite. Layers 14,16, may be evaporated, sputtered or electroplated on a substrate 12 with thicknesses of 200 to 2000 and 50 to 400 Šngstroms respectively. The bias may be established due to exchange or epitaxially coupled layers 14, 16, there being direct atomic contact between the layers. In another form the biasing layer 14 is a composite layer comprising exchange or epitaxially coupled films with a magnetically soft film atomically coupled to a magnetically hard film, e.g. Ni-Fe deposited on a Fe 2 O 3 , a Fe 2 O 3 on Ni-Fe, Co or Co-rich Ni-Co on vanadium or chromium, or binary Co-P. In a further form, the bias layer, or two bias layers with the sensing layer therebetween, is or are formed by preferentially oxiding one or both surfaces of a permalloy sensor strip. Alternatively such surfaces may have localized zones with a raised coercivity produced by chemical reaction with chlorides or sulphates, etching to roughen the surfaces, or by selective deposition of materials which exchange couple to the sensing layer. The combined sensing and bias layers may be surrounded by a magnetic shield (8) in a record head, Fig. 1 (not shown). The head may be used for reading tapes, discs, magnetic ink, or sheets capable of generating and transporting magnetic bubble domains.

    9.
    发明专利
    未知

    公开(公告)号：BR8004022A

    公开(公告)日：1981-01-21

    申请号：BR8004022

    申请日：1980-06-26

    Applicant: IBM

    Inventor： ROMANKIW L ,  MIERSCH E

    IPC: H05K1/05 ,  H01L21/60 ,  H01L23/12 ,  H01L23/14 ,  H01L23/52 ,  H01L23/538 ,  H05K1/11 ,  H05K3/32 ,  H05K3/46 ,  H01L25/00

    Abstract: The board includes two parallel power plates (10, 11) separated by a dielectric layer (not shown). The plates (10, 11) are comprised of two mating metal sheets and are each provided with integral conductive pads (42, 40) and openings (41, 43). After assembly of the two plates (10, 11) and interleaved dielectric layer (not shown), each pad (40, 42) on the two plates is inserted into the coaxial opening (41, 43) in the opposite plate so as to form on the outside surfaces of the two plates (10, 11) areas comprising connection terminals for connecting LSI chips. Each of these area is insulated from the coplanar surrounding metal plate area by the dielectric layer (not shown).

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