公开(公告)号：GB2345201A

公开(公告)日：2000-06-28

申请号：GB9929678

申请日：1999-12-15

Applicant: IBM

Inventor： NAGASAWA TAKASHI ,  MEZAKI KUNIO ,  TAKAMOTO MITSUO ,  KUROKAWA HIROSHI ,  OHSAWA MASAYUKI ,  OHKI NORIO ,  KOBAYASHI SHIGETAKA ,  OHTSUK OSAMU ,  ISO TOSHIAKI

IPC: G02F1/13 ,  H01R12/70 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R12/02 ,  G01R1/073

Abstract: A first substrate (102) has terminals 101 at a constant pitch. A second substrate has some terminals at this same pitch, but some at a wider spacing. Dummy conductors on the first substrate continue at the same spacing and do not connect to the second substrate's conductors. Conductors 3, 4 on a substrate 1 are alternately longer and shorter, so that they do not short together when the substrate is cut (see figure 5C).