公开(公告)号：GB2345201A

公开(公告)日：2000-06-28

申请号：GB9929678

申请日：1999-12-15

Applicant: IBM

Inventor： NAGASAWA TAKASHI ,  MEZAKI KUNIO ,  TAKAMOTO MITSUO ,  KUROKAWA HIROSHI ,  OHSAWA MASAYUKI ,  OHKI NORIO ,  KOBAYASHI SHIGETAKA ,  OHTSUK OSAMU ,  ISO TOSHIAKI

IPC: G02F1/13 ,  H01R12/70 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R12/02 ,  G01R1/073

Abstract: A first substrate (102) has terminals 101 at a constant pitch. A second substrate has some terminals at this same pitch, but some at a wider spacing. Dummy conductors on the first substrate continue at the same spacing and do not connect to the second substrate's conductors. Conductors 3, 4 on a substrate 1 are alternately longer and shorter, so that they do not short together when the substrate is cut (see figure 5C).

公开(公告)号：JP2004022604A

公开(公告)日：2004-01-22

申请号：JP2002171881

申请日：2002-06-12

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SETOGAWA MASUZO ,  KOBAYASHI SHIGETAKA

IPC: G02F1/1345 ,  H01L21/60 ,  H05K3/32 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a mounting device or the like in which the adjustment of flatness of a heater tool can be easily performed.
SOLUTION: After the coarse adjustment of flatness has been performed by means of a second heater block 34, the fine adjustment of flatness is performed by means of a flatness fine adjusting block 33. Then, the adjustment of the flatness of the top end surface 31a of the heater tool 31 is performed by partially refrigerating the flatness fine adjusting block 33 with air passed through an air passage 40. Further, a change in pressure generated according to the flatness of the apical surface 31a of the heater tool 31 is detected by a pressure sensor 41 which controlls air supply to the fine adjusting block 33 based on the detected result.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2000206195A

公开(公告)日：2000-07-28

申请号：JP384699

申请日：1999-01-11

Applicant: IBM ,  NIPPON VENTURE KOGYO KK ,  TORAY ENG CO LTD

Inventor： KOBAYASHI SHIGETAKA ,  EBA TOSHIYUKI ,  TAWARA TAKANORI ,  SATO KENJI ,  WADA HIROMITSU

IPC: G01R1/06 ,  G01R31/28 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To improve the reliability of connection of a prober to the electrodes of a substrate to be inspected by pressing the prober against the electrode- formed part of the substrate to be inspected by a pressing means formed of a plurality of divided pressing heads. SOLUTION: This device is a prober pressing device provided with a pressing means 30 to press a plane prober 6 against the electrode-formed part 4 of a substrate to be inspected 3, and the pressing means 30 is formed of a plurality of divided pressing heads 13. Each of the pressing heads 13 is provided with a pressing surface 32 in the vicinity of its one end to be pressed against a predetermined location of the plane-shaped prober 6. In the device 10, the pressing heads 13 are mounted in such a way as to be each independently rotated on a rotating shaft 14 so as to be capable of each independently pressing the plane-shaped prober 6. In addition, by rotating the pressing heads 13 by a cylinder 16, the pressing surface 32 are pressed against predetermined locations of the plane-shaped prober 6. Furthermore, by joining the vicinities of the intermediate parts of the pressing heads 13 to a machine base 11 by the rotating shaft 14 and applying force onto force points 36, the pressing surfaces 32 are pressed against the predetermined location of the plane prober 6.

公开(公告)号：JP2000183480A

公开(公告)日：2000-06-30

申请号：JP35702198

申请日：1998-12-16

Applicant: IBM ,  HITACHI CHEMICAL CO LTD

Inventor： KOBAYASHI SHIGETAKA ,  OTSUKA OSAMU ,  ISO TOSHIAKI ,  KUROKAWA HIROSHI ,  OSAWA MASAYUKI

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board with improved suppression of short- circuiting failures, and its manufacturing method. SOLUTION: A wiring board is provided with a plurality of conductors 6 for terminal which are in parallel at the end part of a substrate 1, and is also provided with a conductor 3 to a first terminal, that is formed over an outer shape line 2 of the end part before subjecting it to shape machining and a conductor 4 for a second terminal, that is formed only on the inside from the outer shape line 2 of the end part. The conductor 3 for the first terminal and the conductor 4 for the second terminal are formed alternately.

公开(公告)号：JP2003140164A

公开(公告)日：2003-05-14

申请号：JP2001327472

申请日：2001-10-25

Applicant: IBM

Inventor： WADA TAKEHIKO ,  KOBAYASHI SHIGETAKA ,  KAYAMA TAKUSHI ,  MORITA HIDEYUKI

IPC: G02F1/1343 ,  G02F1/13 ,  G02F1/1333 ,  G02F1/1345 ,  G09F9/00 ,  G09F9/30

Abstract: PROBLEM TO BE SOLVED: To provide a method of repairing extraction wiring sections of a liquid crystal display device. SOLUTION: Repairing is performed by irradiating the connection pads of the extraction wiring sections of the liquid crystal display device with a laser beam of prescribed energy. The connection pads have an ITO surface layer, Mo/Al/Mo under layer, and an undesirable MoO3 insulating layer formed between an ITO layer and an Mo layer. The insulating layer is formed in forming the polymer layer of the PFA liquid crystal display device. The MoO3 insulating layer is heated by irradiating the same with a laser beam having the prescribed energy to the extent of maintaining the uniformity of the ITO surface layer. The thermal energy cuts the bonds of the oxygen of the MoO3 layer and the insulating layer is made conductive. The resistance value of the connection pads is lowered, the uniformity of the ITO surface layer is maintained and the packaging of a driver IC is made possible.

公开(公告)号：JP2002249751A

公开(公告)日：2002-09-06

申请号：JP2001036209

申请日：2001-02-13

Applicant: IBM

Inventor： KOBAYASHI SHIGETAKA ,  YAMADA TAKESHI ,  HANADA MASAKI

IPC: C09J201/00 ,  B29C35/08 ,  B29C43/36 ,  B29C65/14 ,  B29C65/48 ,  C09J5/06 ,  H01L21/00 ,  H01L21/58 ,  H05K1/03 ,  H05K3/32 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a technique suppressing a temperature gradient occurring in making a joining using a thermosetting ACF(anisotropic conductive film) and thus enabling the thermosetting ACF to be efficiently melted and set without involving addition of any new step. SOLUTION: This technique comprises the following steps: a silicon chip 21 is supplementarily heated by thermal conduction from a heater tool; an array substrate 23 makes a self-heat generation by radiant heat generated by irradiation of near-infrared rays 36; a thermosetting ACF 24 is heated by thermal conduction from the array substrate 23 that made a self-heat generation; further, the thermosetting ACF 24 makes a self-heat generation by radiant heat generated by irradiation of the near-infrared rays 36 transmitted through the array substrate 23; at this time, a thermal conduction occurs from the thermosetting ACF to the silicon chip 21, and the silicon chip 21 is also heated to a specified temperature by the resulting conducted heat.

公开(公告)号：JP2002025737A

公开(公告)日：2002-01-25

申请号：JP2000180697

申请日：2000-06-16

Applicant: IBM ,  HITACHI CHEMICAL CO LTD

Inventor： KOBAYASHI SHIGETAKA ,  OKI NORIO ,  NAOI SHIGEO ,  NAGASAWA TAKASHI

IPC: G02F1/1345 ,  G01R1/04 ,  G02F1/13 ,  G09G3/00 ,  H01R4/04 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a connecting member supporting member of superior thermal conductivity and superior workability. SOLUTION: In a base material for supporting a connecting member for temporarily electrically connecting a first base board, having a terminal and a second base board having a connecting pad, this connecting member supporting member thermally separates a place for supporting place, for contacting the second base board and a connecting member and a place for supporting the first base board.

公开(公告)号：JP2000183486A

公开(公告)日：2000-06-30

申请号：JP35702298

申请日：1998-12-16

Applicant: IBM ,  HITACHI CHEMICAL CO LTD

Inventor： KOBAYASHI SHIGETAKA ,  OKI NORIO ,  NAGASAWA TAKASHI ,  ISO TOSHIAKI ,  OTSUKA OSAMU ,  MESAKI KUNIO ,  TAKAMOTO MITSUO

IPC: H05K1/14

Abstract: PROBLEM TO BE SOLVED: To enhance suppression of a short-circuit caused by an operating error by connecting conductors at the same pitch on a predetermined part as a pitch of connecting pads, and providing dummy conductors having the same pitch as that of the predetermined part even on a larger part than the connecting pitch. SOLUTION: A second board 21 has a part having a predetermined pitch of connecting pads and a part having larger pitch than that of the predetermined part. A width of a conductor 101 is preferably set to a width of 1/3 or less of a width of the connecting pad 201 of a second board 21, and 2/3 of the width of connecting pad 201 of the board 21. In the case of aligning for the connection, 2/3 of the width of the pad 201 of the board 21 can be prepared for the error. Further, a width of a conductor 101 of a surface not brought into contact with an insulating board 102 can be set to 1/3 or below of the width of the pad 201 of the board 21 by utilizing that a width of the conductor 101 of the surface not brought into contact with an insulating base material 102 becomes smaller than that of the conductor 101 of the surface brought into contact therewith. A pitch between the conductors is preferably in a range of 0.02 to 2 mm.

公开(公告)号：JPH02297647A

公开(公告)日：1990-12-10

申请号：JP11728289

申请日：1989-05-12

Applicant: IBM JAPAN

Inventor： INAZUMI JUNICHI ,  KOBAYASHI SHIGETAKA ,  NAKAMOTO ATSUSHI

IPC: G06F12/16 ,  G06F11/10 ,  G06F11/20 ,  G11C29/00

Abstract: PURPOSE:To increase a usable memory space by providing a means to control a multiplexer so as to exchange a row address signal and a column address signal and to generate a signal with responding to an address switching signal. CONSTITUTION:By responding to a selecting signal supplied from a controller 1, a multiplexer 4 selectively supplies high-order 10 bits and low-order 10 bits out of the address signal of 20 bits to an address decoder 7. The address decoder 7 supplies this signal respectively to a row address line driver 8 and a column address line driver 9. Accordingly, the address signal of 20 bits sent from the controller 1 is controlled by the selecting signal and can address an arbitrary location in a memory 2 as the row address signal of 10 bits and the column address signal of 10 bits. Thus, the capacity of a usable block without error is increased.

公开(公告)号：JP2003332378A

公开(公告)日：2003-11-21

申请号：JP2002133314

申请日：2002-05-08

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

Inventor： KOJIMA EISAKU ,  KOBAYASHI SHIGETAKA ,  KAYAMA TAKUSHI

IPC: G02F1/1345 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To detect fine displacement of overlapped electrodes.
SOLUTION: Displacement of electrodes is detected by monitoring the shape or the amount of the condition of a TCPOLB electrode lead 221 overlapping a cell OLB electrode pad 121, where a first cutout section 122 and a second cutout section 123 are provided symmetric about a point and that the section corresponding to the first cutout section 122, and the second cutout section 123 is covered with the TCPOLB electrode lead 221. Moreover, displacement is corrected based on the result of displacement detection.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：检测重叠电极的精细位移。 解决方案：通过监测与单元OLB电极焊盘121重叠的TCPOLB电极引线221的状态的形状或数量来检测电极的位移，其中第一切口部分122和第二切口部分123被设置成对称关于 并且与第一切口部122对应的部分和第二切口部123被TCPOLB电极引线221覆盖。此外，基于位移检测的结果来校正位移。 版权所有（C）2004，JPO