公开(公告)号：DE2356954A1

公开(公告)日：1974-05-30

申请号：DE2356954

申请日：1973-11-15

Applicant: IBM

Inventor： APPENZELLER HENRY ALBERT ,  MILLER JOSEPH CHARLES ,  SHEA VINCENT

IPC: B23Q3/08 ,  B21D43/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/673 ,  B25B11/00 ,  B23Q3/06

Abstract: A wafer transport apparatus to lock and hold a wafer in a predetermined contoured position while permitting transport of the wafer from the contouring apparatus to a remote location for further processing on the contoured wafer surface. The apparatus comprises a pallet having a plurality of pedestals therein, and vacuum cups at one extended end of the pedestals for supporting and gripping a wafer thereon. Means are provided to permit reciprocation of individual ones of the pedestals in the pallet, when the pallet is positioned in the contouring apparatus, and pedestal locks are provided to grasp and lock individual ones of the pedestals in an individually determinable position, while holding the pedestals in that position so that the pallet may be removed from the apparatus and positioned at some remote station.

公开(公告)号：DE3685093D1

公开(公告)日：1992-06-04

申请号：DE3685093

申请日：1986-10-28

Applicant: IBM

Inventor： ARLDT BRIAN DUDLEY ,  LOEB JONATHON TODD ,  MILLER JOSEPH CHARLES ,  PARSAPOUR HOSSEIN BAHMAN ,  RASCOE III FRED HILL ,  WOODWARD DON WAYNE

IPC: B65H3/56 ,  B65H1/08 ,  B65H3/60 ,  G07D11/00 ,  G07D1/00