EXPOSURE MASK AND PROJECTION EXPOSURE SYSTEM

    公开(公告)号:DE2860442D1

    公开(公告)日:1981-02-26

    申请号:DE2860442

    申请日:1978-11-10

    Applicant: IBM

    Abstract: In a projection printing system the pattern mask, whose image is projected onto a light sensitive layer, is protected with a thin, 0.2-6 micron thick, transparent film or pellicle which is positioned an optically large distance of about 1-125 mm from the mask surface by a spacer member. Any dirt particles on the surface of the pellicle will be out of focus and are not printed in the light sensitive layer. A pellicle can also be employed to protect the light sensitive layer at the image plane.

    2.
    发明专利
    未知

    公开(公告)号:DE2356954A1

    公开(公告)日:1974-05-30

    申请号:DE2356954

    申请日:1973-11-15

    Applicant: IBM

    Abstract: A wafer transport apparatus to lock and hold a wafer in a predetermined contoured position while permitting transport of the wafer from the contouring apparatus to a remote location for further processing on the contoured wafer surface. The apparatus comprises a pallet having a plurality of pedestals therein, and vacuum cups at one extended end of the pedestals for supporting and gripping a wafer thereon. Means are provided to permit reciprocation of individual ones of the pedestals in the pallet, when the pallet is positioned in the contouring apparatus, and pedestal locks are provided to grasp and lock individual ones of the pedestals in an individually determinable position, while holding the pedestals in that position so that the pallet may be removed from the apparatus and positioned at some remote station.

    WAFER INTERLOCKING TRANSPORT SYSTEM

    公开(公告)号:CA996144A

    公开(公告)日:1976-08-31

    申请号:CA184337

    申请日:1973-10-26

    Applicant: IBM

    Abstract: A wafer transport apparatus to lock and hold a wafer in a predetermined contoured position while permitting transport of the wafer from the contouring apparatus to a remote location for further processing on the contoured wafer surface. The apparatus comprises a pallet having a plurality of pedestals therein, and vacuum cups at one extended end of the pedestals for supporting and gripping a wafer thereon. Means are provided to permit reciprocation of individual ones of the pedestals in the pallet, when the pallet is positioned in the contouring apparatus, and pedestal locks are provided to grasp and lock individual ones of the pedestals in an individually determinable position, while holding the pedestals in that position so that the pallet may be removed from the apparatus and positioned at some remote station.

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