公开(公告)号：GB2550791A

公开(公告)日：2017-11-29

申请号：GB201713533

申请日：2016-02-15

Applicant: IBM

Inventor： EVAN GEORGE COLGAN ,  MONTY MONTAGUE DENNEAU ,  JOHN KNICKERBOCKER

IPC: H01L23/367 ,  G06F1/20 ,  H01L23/473

Abstract: A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.

公开(公告)号：GB2550791B

公开(公告)日：2020-07-29

申请号：GB201713533

申请日：2016-02-15

Applicant: IBM

Inventor： EVAN GEORGE COLGAN ,  MONTY MONTAGUE DENNEAU ,  JOHN KNICKERBOCKER

IPC: H01L23/367 ,  G06F1/20 ,  H01L23/473

Abstract: A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.