公开(公告)号：GB2562941B

公开(公告)日：2020-12-16

申请号：GB201812268

申请日：2016-12-02

Applicant: IBM

Inventor： JEFFREY GELORME ,  LI-WEN HUNG ,  PAUL ANDRY ,  BING DANG ,  CORNELIA TSANG YANG ,  JOHN KNICKERBOCKER

IPC: H01L21/673

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

公开(公告)号：GB2586939A

公开(公告)日：2021-03-10

申请号：GB202100095

申请日：2019-05-17

Applicant: IBM

Inventor： MINHUA LU ,  VINCE SIU ,  RUSSELL BUDD ,  EVAN COLGAN ,  JOHN KNICKERBOCKER

IPC: G01N21/78 ,  G01N21/75 ,  G01N21/77 ,  G01N21/79 ,  G01N21/84 ,  G01N33/543

Abstract: Techniques for colorimetric based test strip analysis and reader system are provided. In one aspect, a method of test strip analysis includes: illuminating a test strip wetted with a sample with select spectrums of light, wherein the test strip includes test pads that are configured to change color in the presence of an analyte in the sample; obtaining at least one digital image of the test strip; and analyzing color intensity from the at least one digital image against calibration curves to determine an analyte concentration in the sample with correction for one or more interference substances in the sample that affect the color intensity. A calibration method and a reader device are also provided.

公开(公告)号：GB2581275A

公开(公告)日：2020-08-12

申请号：GB202004604

申请日：2018-09-07

Applicant: IBM

Inventor： VINCE SIU ,  MINHUA LU ,  EVAN COLGAN ,  RUSSELL BUDD ,  JOHN KNICKERBOCKER

IPC: G01N21/00

Abstract: A submersible sensor device configured as a small pellet for testing biological and other liquid samples is provided. In one aspect, a sensing device includes: a housing; and one or more sensors contained within the housing, wherein the housing hermetically seals the sensors such that the sensing device is fully submersible in a liquid analyte. A method and system for analysis of a liquid sample using the present sensing device are also provided.

公开(公告)号：GB2581275B

公开(公告)日：2022-09-14

申请号：GB202004604

申请日：2018-09-07

Applicant: IBM

Inventor： VINCE SIU ,  MINHUA LU ,  EVAN COLGAN ,  RUSSELL BUDD ,  JOHN KNICKERBOCKER

IPC: G01N21/84 ,  G01N21/78 ,  G01N33/543 ,  G01N33/558 ,  G16H10/40

Abstract: A submersible sensor device configured as a small pellet for testing biological and other liquid samples is provided. In one aspect, a sensing device includes: a housing; and one or more sensors contained within the housing, wherein the housing hermetically seals the sensors such that the sensing device is fully submersible in a liquid analyte. A method and system for analysis of a liquid sample using the present sensing device are also provided.

公开(公告)号：GB2603839A

公开(公告)日：2022-08-17

申请号：GB202117435

申请日：2021-12-02

Applicant: IBM

Inventor： QIANWEN CHEN ,  JAE-WOONG NAH ,  BING DANG ,  LEANNA PANCOAST ,  JOHN KNICKERBOCKER

IPC: H01M10/04 ,  H01M6/40 ,  H01M10/0585 ,  H01M50/119

Abstract: A microbattery includes a first micro-battery device including a substrate 102 having a metal anode via 104 and a metal cathode via 104. A battery element 112 formed on the substrate includes a cathode current collector 114 electrically connected to a cathode through the metal cathode via and an anode current collector 106 electrically connected to an anode 110 through the metal anode via. A metal sealing layer 124 is formed on at least sidewall surfaces of the battery element and is electrically connected to the cathode. A method of forming a microbattery device involves forming a metal anode via and a metal cathode via in a substrate, forming a metal layer 108 on a bottom side of the substrate, forming a battery element on a top side of the substrate, forming an encapsulation layer 116 around the battery element, forming trenches (150, Figure 1F) through the encapsulation layer and the substrate on different sides of the battery element, and forming a metal sealing layer in the trenches to cover at least sidewall surfaces of the battery element. The metal sealing layer is electrically connected to the battery element through the metal layer and the metal cathode via.

公开(公告)号：GB2609127B

公开(公告)日：2025-04-30

申请号：GB202214682

申请日：2021-02-01

Applicant: IBM

Inventor： BING DANG ,  LEANNA PANCOAST ,  JAE-WOONG NAH ,  JOHN KNICKERBOCKER

IPC: H01M10/0525 ,  H01M10/04 ,  H01M10/052 ,  H01M10/0562 ,  H01M10/0585

Abstract: Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.

公开(公告)号：GB2586939B

公开(公告)日：2021-06-30

申请号：GB202100095

申请日：2019-05-17

Applicant: IBM

Inventor： MINHUA LU ,  VINCE SIU ,  RUSSELL BUDD ,  EVAN COLGAN ,  JOHN KNICKERBOCKER

IPC: G01N21/78 ,  G01N21/75 ,  G01N21/77 ,  G01N21/79 ,  G01N21/84 ,  G01N33/543

Abstract: Techniques for colorimetric based test strip analysis and reader system are provided. In one aspect, a method of test strip analysis includes: illuminating a test strip wetted with a sample with select spectrums of light, wherein the test strip includes test pads that are configured to change color in the presence of an analyte in the sample; obtaining at least one digital image of the test strip; and analyzing color intensity from the at least one digital image against calibration curves to determine an analyte concentration in the sample with correction for one or more interference substances in the sample that affect the color intensity. A calibration method and a reader device are also provided.

公开(公告)号：GB2585319A

公开(公告)日：2021-01-06

申请号：GB202017218

申请日：2019-05-02

Applicant: IBM

Inventor： KATSUYUKI SAKUMA ,  JOHN KNICKERBOCKER ,  STEPHEN JOHN HEISIG ,  JOHN JEREMY RICE ,  GADDI BLUMROSEN

IPC: G06F3/01

Abstract: Writing recognition using a wearable pressure sensing device includes receiving pressure measurement data from a pressure sensor disposed upon a body part of a user. The pressure measurement data is indicative of a change in pressure of the body part due to an interaction of the body part with a medium indicative of a writing gesture by the user. A start boundary and end boundary for each of a plurality of writing symbols is detected based upon the pressure measurement data. At least one feature of the pressure measurement data associated with the plurality of writing symbols is extracted. A symbol pattern is detected based upon the extracted features, and at least one letter is detected based upon the symbol pattern. A word is detected based upon the detected at least one letter.

公开(公告)号：GB2550791B

公开(公告)日：2020-07-29

申请号：GB201713533

申请日：2016-02-15

Applicant: IBM

Inventor： EVAN GEORGE COLGAN ,  MONTY MONTAGUE DENNEAU ,  JOHN KNICKERBOCKER

IPC: H01L23/367 ,  G06F1/20 ,  H01L23/473

Abstract: A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.

公开(公告)号：GB2627899B

公开(公告)日：2025-02-12

申请号：GB202408555

申请日：2022-09-04

Applicant: IBM

Inventor： AKIHIRO HORIBE ,  QIANWEN CHEN ,  RISA MIYAZAWA ,  MICHAEL BELYANSKY ,  JOHN KNICKERBOCKER ,  TAKASHI HISADA

IPC: H01L21/683

Abstract: Handler wafers and methods of handling a wafer include positioning a handler, which is attached to a wafer by a bonding layer that comprises a debonding layer, an optical enhancement layer, and an anti-reflection layer. The handler is debonded from the wafer using a laser that emits laser energy at a wavelength that is absorbed by the debonding layer and that is confined to the debonding layer by the optical enhancement layer, such that the material of the debonding layer ablates when exposed to the laser energy to release the wafer.