公开(公告)号：DE3165480D1

公开(公告)日：1984-09-20

申请号：DE3165480

申请日：1981-02-25

Applicant: IBM

Inventor： MOSER FLOYD RICHARD ,  NOTH RICHARD WILLIAM

IPC: H01L23/28 ,  H01L21/50 ,  H01L23/055 ,  H01L21/98 ,  H01L23/10

Abstract: A method of packaging an electronic module in a cap is disclosed. The module, comprising one or more silicon chips (10) mounted on a substrate (12) and having the 'chips sealed onto the substrate with a silicone polymer is supported on a cap (20) with the chips disposed inwardly. An epoxy sealant (30) is dispensed on the back surface of the substrate (12) and allowed to seal the gap (34) between the substrate and cap (20). The sealant (30) is cured by first heating the assembly to a temperature which will gel the sealant. The temperature and rate of heating are selected so that the temperature is stabilized before the critical viscosity of the epoxy is reached. Subsequently, a higher temperature is used to complete the cure. No significant decrease in temperature is permitted after the dispensing and flowing of the epoxy.