公开(公告)号：DE69226398D1

公开(公告)日：1998-09-03

申请号：DE69226398

申请日：1992-04-29

Applicant: IBM

Inventor： GOW JOHN ,  NOTH RICHARD WILLIAM

IPC: H01L21/60 ,  H01L23/495

Abstract: An improved package for semiconductor chips, and method of forming the package are provided. The package includes a lead frame (12) having a central chip (10) bonding portion and first (16) and second (18) sets of interdigitaled fingers. The inner ends of the first set of fingers terminate at a distance from the central chip bonding portion closer than the inner ends of the fingers of the second set at fingers. A semiconductor chip, having input/output pads is bonded to the central chip bonding portion (13). A first set of wires (20) directly couples respective input/output pads on the chip to the first set of fingers. A second set of wires (22) couples respective input/output pads on the chip with the second set of fingers. Each of the wires of the second set of wires has a first segment extending from its respective input/output pad to an intermediate bonding region, and a second segment extending from the intermediate bonding region to its respective finger of the second set of fingers.

公开(公告)号：DE69226398T2

公开(公告)日：1999-03-25

申请号：DE69226398

申请日：1992-04-29

Applicant: IBM

Inventor： GOW JOHN ,  NOTH RICHARD WILLIAM

IPC: H01L21/60 ,  H01L23/495

Abstract: An improved package for semiconductor chips, and method of forming the package are provided. The package includes a lead frame (12) having a central chip (10) bonding portion and first (16) and second (18) sets of interdigitaled fingers. The inner ends of the first set of fingers terminate at a distance from the central chip bonding portion closer than the inner ends of the fingers of the second set at fingers. A semiconductor chip, having input/output pads is bonded to the central chip bonding portion (13). A first set of wires (20) directly couples respective input/output pads on the chip to the first set of fingers. A second set of wires (22) couples respective input/output pads on the chip with the second set of fingers. Each of the wires of the second set of wires has a first segment extending from its respective input/output pad to an intermediate bonding region, and a second segment extending from the intermediate bonding region to its respective finger of the second set of fingers.

公开(公告)号：DE3165480D1

公开(公告)日：1984-09-20

申请号：DE3165480

申请日：1981-02-25

Applicant: IBM

Inventor： MOSER FLOYD RICHARD ,  NOTH RICHARD WILLIAM

IPC: H01L23/28 ,  H01L21/50 ,  H01L23/055 ,  H01L21/98 ,  H01L23/10

Abstract: A method of packaging an electronic module in a cap is disclosed. The module, comprising one or more silicon chips (10) mounted on a substrate (12) and having the 'chips sealed onto the substrate with a silicone polymer is supported on a cap (20) with the chips disposed inwardly. An epoxy sealant (30) is dispensed on the back surface of the substrate (12) and allowed to seal the gap (34) between the substrate and cap (20). The sealant (30) is cured by first heating the assembly to a temperature which will gel the sealant. The temperature and rate of heating are selected so that the temperature is stabilized before the critical viscosity of the epoxy is reached. Subsequently, a higher temperature is used to complete the cure. No significant decrease in temperature is permitted after the dispensing and flowing of the epoxy.