公开(公告)号：JPH1095833A

公开(公告)日：1998-04-14

申请号：JP18344897

申请日：1997-07-09

Applicant: IBM

Inventor： KUCZYNSKI JOSEPH PAUL ,  MULHOLLAND LAURA MARIE

IPC: C08K3/18 ,  C08F2/46 ,  C08G59/18 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08K3/30 ,  C08K3/36 ,  C08K7/16 ,  C08L63/00 ,  G03F7/038 ,  H01L23/29 ,  H01L23/498

Abstract: PROBLEM TO BE SOLVED: To obtain a thermosetting compd. which is cured by the exposure to chemical rays and is useful as a reprocessible capsule material for integrated circuits by compounding a specific acetal diepoxide with a photo/acid-generated photoinitiator. SOLUTION: This material is an uncured thermosetting compd. which is cured by the exposure to chemical rays and contains an acetal diepoxide represented by the formula [wehrein R and R' are each an aliph. or alicyclic epoxy part; R1 to R4 are each alkyl, substd. alkyl, aryl, or aralkyl; and R2 and R3 are each H, alkyl, alkoxy, substd. alkaryl, alkaryl, or cycloalkyl] and a photo/acid generated photoinitiator. The compd. may further contain a second epoxy-functional resin, an inorg. filler, a plasticizer, etc. A cured capsule material contg. the compd. is dissolvable in a dil. acidic soln. and can be recycled.

公开(公告)号：DE69738559D1

公开(公告)日：2008-04-24

申请号：DE69738559

申请日：1997-07-30

Applicant: IBM

Inventor： KUCZYNSKI JOSEPH PAUL ,  MULHOLLAND LAURA MARIE

IPC: C08G59/18 ,  C08K3/18 ,  C08F2/46 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08K3/30 ,  C08K3/36 ,  C08K7/16 ,  C08L63/00 ,  G03F7/038 ,  H01L23/29 ,  H01L23/498

Abstract: An uncured thermosetting composition which is capable of curing upon exposure to actinic radiation is disclosed. The composition includes an acetal diepoxide of the formula: wherein R and R' are individually an aliphatic epoxy, or a cycloaliphatic epoxy; R1 and R4 are individually an alkyl, substituted alkyl, aryl, aryl alkyl; and R2 and R3 are individually hydrogen, alkyl, alkoxy, substituted alkyl aryl, alkyl aryl, and cyclic alkyl, as well as a photo initiator, and an inorganic filler. The composition of the invention may also include a second epoxy functional resin, a flexibilizer, and other adjuvants. Other aspects of the invention include the cured resin encapsulant and a method of recovering the resin from a circuit assembly.

公开(公告)号：DE69738559T2

公开(公告)日：2009-04-02

申请号：DE69738559

申请日：1997-07-30

Applicant: IBM

Inventor： KUCZYNSKI JOSEPH PAUL ,  MULHOLLAND LAURA MARIE

IPC: C08G59/18 ,  C08K3/18 ,  C08F2/46 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08K3/30 ,  C08K3/36 ,  C08K7/16 ,  C08L63/00 ,  G03F7/038 ,  H01L23/29 ,  H01L23/498

Abstract: An uncured thermosetting composition which is capable of curing upon exposure to actinic radiation is disclosed. The composition includes an acetal diepoxide of the formula: wherein R and R' are individually an aliphatic epoxy, or a cycloaliphatic epoxy; R1 and R4 are individually an alkyl, substituted alkyl, aryl, aryl alkyl; and R2 and R3 are individually hydrogen, alkyl, alkoxy, substituted alkyl aryl, alkyl aryl, and cyclic alkyl, as well as a photo initiator, and an inorganic filler. The composition of the invention may also include a second epoxy functional resin, a flexibilizer, and other adjuvants. Other aspects of the invention include the cured resin encapsulant and a method of recovering the resin from a circuit assembly.