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    REPROCESSIBLE PHOTOSENSITIVE CAPSULE MATERIAL
    1.
    发明专利
    REPROCESSIBLE PHOTOSENSITIVE CAPSULE MATERIAL 失效

    公开(公告)号：JPH1095833A

    公开(公告)日：1998-04-14

    申请号：JP18344897

    申请日：1997-07-09

    Applicant: IBM

    Inventor： KUCZYNSKI JOSEPH PAUL ,  MULHOLLAND LAURA MARIE

    IPC: C08K3/18 ,  C08F2/46 ,  C08G59/18 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08K3/30 ,  C08K3/36 ,  C08K7/16 ,  C08L63/00 ,  G03F7/038 ,  H01L23/29 ,  H01L23/498

    Abstract: PROBLEM TO BE SOLVED: To obtain a thermosetting compd. which is cured by the exposure to chemical rays and is useful as a reprocessible capsule material for integrated circuits by compounding a specific acetal diepoxide with a photo/acid-generated photoinitiator. SOLUTION: This material is an uncured thermosetting compd. which is cured by the exposure to chemical rays and contains an acetal diepoxide represented by the formula [wehrein R and R' are each an aliph. or alicyclic epoxy part; R1 to R4 are each alkyl, substd. alkyl, aryl, or aralkyl; and R2 and R3 are each H, alkyl, alkoxy, substd. alkaryl, alkaryl, or cycloalkyl] and a photo/acid generated photoinitiator. The compd. may further contain a second epoxy-functional resin, an inorg. filler, a plasticizer, etc. A cured capsule material contg. the compd. is dissolvable in a dil. acidic soln. and can be recycled.

    Improved conformal coating for detecting heat
    2.
    发明专利
    Improved conformal coating for detecting heat 有权
    改进的一体化涂料用于检测热量

    公开(公告)号：JP2004131732A

    公开(公告)日：2004-04-30

    申请号：JP2003345177

    申请日：2003-10-03

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： CHRISTENSEN DALE LARRY ,  KUCZYNSKI JOSEPH PAUL ,  POLESCHUK NICHOLAS ALEXANDER J

    IPC: G01K11/00 ,  C09D7/12 ,  C09D201/00 ,  H05K1/02 ,  H05K3/28

    CPC classification number: H05K3/284 ,  H05K1/0201 ,  H05K2201/10151 ,  H05K2203/083

    Abstract: PROBLEM TO BE SOLVED: To provide a new system for detecting heat by detecting gas emitted from a coating material.
    SOLUTION: The improved conformal coating is obtained by compounded with a foaming agent (in some case called "frother"). The composition of the improved coating emits a specific gas when heated to a specific temperature. The improved coating is applied on an article preferably detecting heat before damaged. A gas sensor is set near the article to detect the emitted gas. When the gas is detected, a suitable treatment for the article is performed so as to decrease heat. In the case of applying the improved coating in the computer industry, the coating is usable with a specific electronic part or a group of the electronic parts (e.g. circuit board).
    COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：提供一种通过检测从涂料发出的气体来检测热量的新系统。 解决方案：通过与发泡剂（在某种情况下称为“起泡剂”）混合来获得改进的保形涂层。 当加热到特定温度时，改进的涂层的组成发射特定的气体。 将改进的涂层施加在优选在损坏之前检测热量的制品上。 气体传感器设置在物品附近以检测排出的气体。 当检测到气体时，进行用于制品的适当处理以降低热量。 在计算机工业中应用改进的涂层的情况下，该涂层可用于特定电子部件或一组电子部件（例如电路板）。 版权所有（C）2004，JPO

    3.
    发明专利
    未知

    公开(公告)号：DE69738559D1

    公开(公告)日：2008-04-24

    申请号：DE69738559

    申请日：1997-07-30

    Applicant: IBM

    Inventor： KUCZYNSKI JOSEPH PAUL ,  MULHOLLAND LAURA MARIE

    IPC: C08G59/18 ,  C08K3/18 ,  C08F2/46 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08K3/30 ,  C08K3/36 ,  C08K7/16 ,  C08L63/00 ,  G03F7/038 ,  H01L23/29 ,  H01L23/498

    Abstract: An uncured thermosetting composition which is capable of curing upon exposure to actinic radiation is disclosed. The composition includes an acetal diepoxide of the formula: wherein R and R' are individually an aliphatic epoxy, or a cycloaliphatic epoxy; R1 and R4 are individually an alkyl, substituted alkyl, aryl, aryl alkyl; and R2 and R3 are individually hydrogen, alkyl, alkoxy, substituted alkyl aryl, alkyl aryl, and cyclic alkyl, as well as a photo initiator, and an inorganic filler. The composition of the invention may also include a second epoxy functional resin, a flexibilizer, and other adjuvants. Other aspects of the invention include the cured resin encapsulant and a method of recovering the resin from a circuit assembly.

    5.
    发明专利
    未知

    公开(公告)号：DE69738559T2

    公开(公告)日：2009-04-02

    申请号：DE69738559

    申请日：1997-07-30

    Applicant: IBM

    Inventor： KUCZYNSKI JOSEPH PAUL ,  MULHOLLAND LAURA MARIE

    IPC: C08G59/18 ,  C08K3/18 ,  C08F2/46 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08K3/30 ,  C08K3/36 ,  C08K7/16 ,  C08L63/00 ,  G03F7/038 ,  H01L23/29 ,  H01L23/498

    Abstract: An uncured thermosetting composition which is capable of curing upon exposure to actinic radiation is disclosed. The composition includes an acetal diepoxide of the formula: wherein R and R' are individually an aliphatic epoxy, or a cycloaliphatic epoxy; R1 and R4 are individually an alkyl, substituted alkyl, aryl, aryl alkyl; and R2 and R3 are individually hydrogen, alkyl, alkoxy, substituted alkyl aryl, alkyl aryl, and cyclic alkyl, as well as a photo initiator, and an inorganic filler. The composition of the invention may also include a second epoxy functional resin, a flexibilizer, and other adjuvants. Other aspects of the invention include the cured resin encapsulant and a method of recovering the resin from a circuit assembly.

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