公开(公告)号：DE3771004D1

公开(公告)日：1991-08-01

申请号：DE3771004

申请日：1987-04-24

Applicant: IBM

Inventor： LINDE HAROLD GEORGE ,  MURPHY ELIZABETH THERESA

IPC: G03C1/74 ,  G03F7/075 ,  G03F7/11 ,  G03F7/16 ,  H05K3/38 ,  G03F7/085

公开(公告)号：DE3770791D1

公开(公告)日：1991-07-18

申请号：DE3770791

申请日：1987-12-15

Applicant: IBM

Inventor： LINDE HAROLD GEORGE ,  MURPHY ELIZABETH THERESA ,  POLEY DENIS JOHN

IPC: C08J11/04 ,  C08J11/00 ,  C09D9/00 ,  H01L21/56 ,  H05K3/28 ,  C11D7/32 ,  C11D7/34 ,  C11D7/50

Abstract: The cleaning compositions of the present invention comprise pyridine or substituted pyridines alone or in admixture with sulfoxides. The present invention is employed to treat integrated circuit modules enclosed in a cap or can. Following treatment the cap or can, which is sealed to the substrate by means of the cured epoxy, can be removed to allow rework. The preferred method of removing the cured epoxy from module substrates is by refluxing in the solution. The cured epoxy is totally removed and there is no attack of the Al-Cu or Sn-Pb metallurgies or chip polyimide passivation. The silicone overcoat material is not removed from behind the chips, eliminating the need to reapply the material after rework.