公开(公告)号：SG34295A1

公开(公告)日：1996-12-06

申请号：SG1995001723

申请日：1995-11-03

Applicant: IBM

Inventor： NAGARAJAN SUBRAHMANYAN

IPC: H05K7/10 ,  H05K7/12 ,  H05K7/14

公开(公告)号：CA2208045C

公开(公告)日：2003-04-15

申请号：CA2208045

申请日：1995-12-05

Applicant: IBM

Inventor： NAGARAJAN SUBRAHMANYAN

IPC: B42D15/10 ,  G06F1/16 ,  G11B25/04 ,  G11B33/02 ,  G11B33/08 ,  G11B33/12 ,  H05K5/02 ,  H05K7/10

Abstract: A removable electronic subassembly is designed for placement into a data processing system which requires said removable electronic subassembly to fi t into an aperture defining a selected form factor. The removable electronic subassembly comprises a rigid enclosure which encloses interior components o f the removable electronic subassembly. The rigid enclosure has exterior dimensions which are smaller than the selected form factor. A layer of resilient material is mounted to an exterior of the rigid enclosure. The lay er of resilient material and the rigid enclosure have at least one exterior dimension which exceeds the selected form factor in an uncompressed state wherein the resilient material may be compressed such that the at least one exterior dimension conforms to the selected form factor.

公开(公告)号：CA2208045A1

公开(公告)日：1996-06-27

申请号：CA2208045

申请日：1995-12-05

Applicant: IBM

Inventor： NAGARAJAN SUBRAHMANYAN

IPC: B42D15/10 ,  G06F1/16 ,  G11B25/04 ,  G11B33/02 ,  G11B33/08 ,  G11B33/12 ,  H05K5/02 ,  H05K7/10

Abstract: A removable electronic subassembly is designed for placement into a data processing system which requires said removable electronic subassembly to fit into an aperture defining a selected form factor. The removable electronic subassembly comprises a rigid enclosure which encloses interior components of the removable electronic subassembly. The rigid enclosure has exterior dimensions which are smaller than the selected form factor. A layer of resilient material is mounted to an exterior of the rigid enclosure. The layer of resilient material and the rigid enclosure have at least one exterior dimension which exceeds the selected form factor in an uncompressed state wherein the resilient material may be compressed such that the at least one exterior dimension conforms to the selected form factor.

公开(公告)号：MY114912A

公开(公告)日：2003-02-28

申请号：MYPI9503717

申请日：1995-12-01

Applicant: IBM

Inventor： NAGARAJAN SUBRAHMANYAN

IPC: H05K7/00 ,  B42D15/10 ,  G06F1/16 ,  G11B25/04 ,  G11B33/02 ,  G11B33/08 ,  G11B33/12 ,  H05K5/02

Abstract: A REMOVABLE ELECTRONIC SUBASSEMBLY (10, 30, 36) IS DESIGNED FOR PLACEMENT INTO A DATA PROCESSING SYSTEM (12) WHICH REQUIRES SAID REMOVABLE ELECTRONIC SUBASSEMBLY TO FIT INTO AN APERTURE (14) DEFINING A SELECTED FORM FACTOR. THE REMOVABLE ELECTRONIC SUBASSEMBLY COMPRISES A RIGID ENCLOSURE (16) WHICH ENCLOSES INTERIOR COMPONENTS OF THE REMOVABLE ELECTRONIC SUBASSEMBLY. THE RIGID ENCLOSURE HAS EXTERIOR DIMENSIONS WHICH ARE SMALLER THAN THE SELECTED FORM FACTOR. A LAYER OF RESILIENT MATERIAL (28, 32) IS MOUNTED TO AN EXTERIOR OF THE RIGID ENCLOSURE. THE LAYER OF RESILIENT MATERIAL AND THE RIGID ENCLOSURE HAVE AT LEAST ONE EXTERIOR DIMENSION WHICH EXCEEDS THE SELECTED FORM FACTOR IN AN UNCOMPRESSED STATE WHEREIN THE RESILIENT MATERIAL MAY BE COMPRESSED SUCH THAT THE AT LEAST ONE EXTERIOR DIMENSION CONFORMS TO THE SELECTED FORM FACTOR. (FIG. 3)

公开(公告)号：DE69508117D1

公开(公告)日：1999-04-08

申请号：DE69508117

申请日：1995-12-05

Applicant: IBM

Inventor： NAGARAJAN SUBRAHMANYAN

IPC: B42D15/10 ,  G06F1/16 ,  G11B25/04 ,  G11B33/02 ,  G11B33/08 ,  G11B33/12 ,  H05K5/02

Abstract: A removable electronic subassembly is designed for placement into a data processing system which requires said removable electronic subassembly to fit into an aperture defining a selected form factor. The removable electronic subassembly comprises a rigid enclosure which encloses interior components of the removable electronic subassembly. The rigid enclosure has exterior dimensions which are smaller than the selected form factor. A layer of resilient material is mounted to an exterior of the rigid enclosure. The layer of resilient material and the rigid enclosure have at least one exterior dimension which exceeds the selected form factor in an uncompressed state wherein the resilient material may be compressed such that the at least one exterior dimension conforms to the selected form factor.

公开(公告)号：DE69508117T2

公开(公告)日：1999-10-14

申请号：DE69508117

申请日：1995-12-05

Applicant: IBM

Inventor： NAGARAJAN SUBRAHMANYAN

IPC: B42D15/10 ,  G06F1/16 ,  G11B25/04 ,  G11B33/02 ,  G11B33/08 ,  G11B33/12 ,  H05K5/02

Abstract: A removable electronic subassembly is designed for placement into a data processing system which requires said removable electronic subassembly to fit into an aperture defining a selected form factor. The removable electronic subassembly comprises a rigid enclosure which encloses interior components of the removable electronic subassembly. The rigid enclosure has exterior dimensions which are smaller than the selected form factor. A layer of resilient material is mounted to an exterior of the rigid enclosure. The layer of resilient material and the rigid enclosure have at least one exterior dimension which exceeds the selected form factor in an uncompressed state wherein the resilient material may be compressed such that the at least one exterior dimension conforms to the selected form factor.

公开(公告)号：CA2089792A1

公开(公告)日：1993-10-31

申请号：CA2089792

申请日：1993-02-18

Applicant: IBM

Inventor： BOIGENZAHN JEFFREY F ,  DAEDE RONALD J ,  MOSER MICHAEL A ,  NAGARAJAN SUBRAHMANYAN ,  OTTESEN HAL H ,  SHARMA ARUN ,  SRI-JAYANTHAN MUTHUTHAMBY

IPC: G11B33/08 ,  H05K7/00 ,  G06F1/16

Abstract: OPTIMUM ROTATIONAL MODE DECOUPLING SHOCK MOUNT CONFIGURATION FOR DASDS An apparatus and a method for decoupling external linear vibration from a device mounted in an enclosure, so as to reduce resulting rotational motion of the device. The apparatus comprises n vibration isolation mounts having characteristics and being positioned so that the center of stiffness and the center of damping coincide with the center of mass of the device. The invention may be applied to direct access storage devices having arbilrary mounting configurations where the geometry of the mounting configurations and/or the mass distribution of the head-disc assembly are not necessarily symmetrical. Alternatively, the damping and stiffness parameters may be isotropic in the plane of the device and the axes of the vibration isolation mounts may be disposed in a direction perpendicular to the plane of the device. The stiffness and damping constants may be equal for each mounting point and the mounting points may be located so as to be symmetric with respect to each other in the plane of the device. The center of stiffness and the center of mass may also be at the same point along an axis perpendicular to the plane of the device. A balancing mass may be applied to the device to change its center of mass to coincide with the center of stiffness. For a given mass and inertia distribution, isolation mountsare designed to be disposed in polygonally shaped configurations so as to satisfy critical equations, so that complete rigid body mode decoupling occurs. With an assumption that the mount stiffness and damping are to be identical for all mounts, the geometry of the locations arc simplified to have symmetries that result in regular polygons such as an isosceles triangle, a trapezoid, a square, a rectangle, etc. YO991-202