公开(公告)号：JPH04326557A

公开(公告)日：1992-11-16

申请号：JP10814891

申请日：1991-04-15

Applicant: IBM

Inventor： NAKAMA SUNAO ,  TSUCHIDA SHUHEI

IPC: H01L23/36 ,  H01L21/60 ,  H01L23/367

Abstract: PURPOSE: To prolong stress service life of a semiconductor chip, while improving the cooling effect of this semiconductor chip and to improve its reliability. CONSTITUTION: A semiconductor chip 4 is attached through a soldering ball 7 to a ground plane layer 2 on a wafer 1 by a face-down system, a heat- conducting member 5 attached to the ground plane 2 is provided through a heat-conducting layer 9 to the semiconductor chip in thermal contact, and heat from the semiconductor chip is radiated over a wide area, while utilizing the ground planar layer. Then, the semiconductor chip and the heat-conducting member are relatively movably contacted, so as not to propagate heat stress from the wafer caused by heating to the semiconductor chip. In this case, the heat-conducting member is made flexible, so as to avoid the effects of heat stress as well.