公开(公告)号：GB2496481B

公开(公告)日：2013-09-25

申请号：GB201218540

申请日：2012-10-16

Applicant: IBM

Inventor： STEINKE MARK EDWARD ,  KAMATH VINOD ,  SCHMIDT DEREK IAN ,  WOMBLE JAMES SCOTT ,  NI CHUNJIAN ,  BARINA RICHARD

IPC: H05K7/20 ,  F28F7/02 ,  G06F1/20 ,  H01L23/473

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

公开(公告)号：GB2498243B

公开(公告)日：2013-11-20

申请号：GB201220532

申请日：2012-11-15

Applicant: IBM

Inventor： BUSCH DIANE SYLVIA ,  JUNE MICHAEL SEAN ,  NI CHUNJIAN ,  RAMINENI PRADEEP

IPC: H01L23/467 ,  F28F7/00 ,  F28F13/00 ,  G06F1/20

公开(公告)号：GB2498243A

公开(公告)日：2013-07-10

申请号：GB201220532

申请日：2012-11-15

Applicant: IBM

Inventor： BUSCH DIANE SYLVIA ,  JUNE MICHAEL SEAN ,  NI CHUNJIAN ,  RAMINENI PRADEEP

IPC: H01L23/467 ,  F28F7/00 ,  F28F13/00 ,  G06F1/20

Abstract: Disclosed is a heat sink with a set of fins that can be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. The heat sink has a base engaged with a rotary member with the fins. A drive member is coupled to the rotary member to rotate the rotary member relative to the base in response to a control signal. The drive member may engage the rotary member via a gear. The heat sink may have a temperature sensor coupled to the base and a controller. The controller may generate the control signal to the minimise the temperature of the base by aligning the fins with the airflow. The drive member may be an electric motor.

公开(公告)号：DE102012219693A1

公开(公告)日：2013-05-16

申请号：DE102012219693

申请日：2012-10-29

Applicant: IBM

Inventor： BARINA RICHARD M ,  KAMATH VINOD ,  NI CHUNJIAN ,  SCHMIDT DEREK I ,  STEINKE MARK E ,  WOMBLE JAMES S

IPC: G06F1/20 ,  H01L23/473 ,  H05K7/20

Abstract: Ein Kühlsystem für ein Speichermodul weist eine Wärmeleitbaugruppe zum Leiten von Wärme vom Speichermodul zu flüssigkeitsgekühlten Montageblöcken auf. In einer Ausführungsform enthält jede Wärmeleitbaugruppe einen Rahmen mit gegenüberliegenden ersten und zweiten Halterungen, erste und zweite Wärmeverteilerplatten, die sich jeweils von der ersten Halterung zur zweiten Halterung erstrecken, und ein Paar abgeflachter Wärmeleitrohre, die sich jeweils entlang einer entsprechenden der Wärmeverteilerplatten von der ersten Halterung zur zweiten Halterung erstrecken. Die flüssigkeitsgekühlten Montageblöcke halten die Wärmeleitbaugruppe trennbar über einem Speichermodulsockel, wobei sich das Speichermodul zwischen den Wärmeverteilerplatten befindet.

公开(公告)号：GB2496481A

公开(公告)日：2013-05-15

申请号：GB201218540

申请日：2012-10-16

Applicant: IBM

Inventor： STEINKE MARK EDWARD ,  KAMATH VINOD ,  SCHMIDT DEREK IAN ,  WOMBLE JAMES SCOTT ,  NI CHUNJIAN ,  BARINA RICHARD

IPC: H05K7/20 ,  F28F7/02 ,  G06F1/20 ,  H01L23/473

Abstract: A cooling system for memory modules for example dual in-line memory modules (DIMMs) supporting dual random access memory (DRAM) chips (Fig. 2; 24) on either side of a circuit board (Fig. 2; 22) comprises a heat conduction assembly 10 for each memory module 20 which allows conduction of heat in a direction parallel to a system board 12, from the memory modules to a pair of liquid-cooled mounting blocks 40, 140 located at opposing ends of parallel slot shaped sockets 30 for receiving the modules. Each heat conduction assembly includes a frame having opposing first and second supports 61, 62, first and second heat spreader plates 64, 65 each extending from the first support 61 to the second support 62, and a pair of fluid-filled flattened heat pipes 66 each extending along a respective one of the heat spreader plates. The liquid-cooled mounting blocks 40, 140 releasably support the heat conduction assemblies over the memory module sockets 30 with the memory module between the heat spreader plates so that the memory chips are in thermal engagement with the heat spreader plates 64, 65.